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公开(公告)号：US20160248392A1
公开(公告)日：2016-08-25
申请号：US14628917
申请日：2015-02-23
Applicant: Raytheon Company
Inventor： Christopher M. Laighton , James A. Robbins , Jonathan B. Langille , Philip M. Henault
CPC classification number: H03F3/602 , H01P5/186 , H01P5/187 , H03F2200/192 , H03F2200/198 , H03F2200/204 , H03F2200/451
Abstract: A power amplifier structure having: a power divider for dividing power in a signal fed to an input port between a pair of output ports. Each one of a pair of amplifiers has: an input coupled to a corresponding one of the pair of power divider output ports; and an output. A power combiner is provided. Signals at the power divider output ports are fed to the inputs of the pair of amplifiers in a forward direction and then pass through the amplifiers in the forward direction towards the outputs of the pair of amplifiers. Connectors direct the signals at the amplifier outputs to the power combiners, the signal then passing through the power combiner to an output port in a direction opposite to the forward direction.
Abstract translation: 一种功率放大器结构，具有：功率分配器，用于分配馈送到一对输出端口之间的输入端口的信号中的功率。 一对放大器中的每一个具有：耦合到所述一对功率分配器输出端口中的相应一个的输入端; 和输出。 提供功率组合器。 功率分配器输出端口处的信号以正向馈送到放大器对的输入端，然后沿着正向通过放大器朝向该对放大器的输出端。 连接器将放大器输出端的信号引导到功率组合器，然后信号通过功率组合器以与正向相反的方向通过输出端口。
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公开(公告)号：US10276282B2
公开(公告)日：2019-04-30
申请号：US15663128
申请日：2017-07-28
Applicant: Raytheon Company
Inventor： Angelo M. Puzella , Lance A. Auer , Norman Armendariz , Donald A. Bozza , John B. Francis , Philip M. Henault , Randal W. Oberle , Susan C. Trulli , Dimitry Zarkh
Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center, and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
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Patent Agency Ranking
公开(公告)号：US20180183146A1
公开(公告)日：2018-06-28
申请号：US15390764
申请日：2016-12-27
Applicant: Raytheon Company
Inventor： Thomas V. Sikina , John P. Haven , Philip M. Henault , Alkim Akyurtlu
CPC classification number: H01Q3/34 , G01S13/02 , G01S2013/0254 , H01P5/16 , H01Q21/0075
Abstract: A via-less beamformer provided from a plurality of circuits elements having circuit layouts selected to mitigate unwanted reactive coupling there between. At least one of the plurality of circuit elements is provided having a circuit layout selected based upon reactive field theory. In one embodiment, a circuit layout may be selected by: determining which circuit features of the circuit elements produce reactive fields in response to a signal provided thereto, separating the total field into a modal set and determining the modal weighting coefficients based on geometrical and/or design features of the of the circuit elements. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits. In one embodiment the via-less beamformer comprises one or more branch hybrid coupler circuits. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits and one or more branch hybrid coupler circuits.
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公开(公告)号：US20190035517A1
公开(公告)日：2019-01-31
申请号：US15663128
申请日：2017-07-28
Applicant: Raytheon Company
Inventor： Angelo M. Puzella , Lance A. Auer , Norman Armendariz , Donald A. Bozza , John B. Francis , Philip M. Henault , Randal W. Oberle , Susan C. Trulli , Dimitry Zarkh
Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center, and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
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公开(公告)号：US09584080B2
公开(公告)日：2017-02-28
申请号：US14628917
申请日：2015-02-23
Applicant: Raytheon Company
Inventor： Christopher M. Laighton , James A. Robbins , Jonathan B. Langille , Philip M. Henault
IPC: H03F3/60
CPC classification number: H03F3/602 , H01P5/186 , H01P5/187 , H03F2200/192 , H03F2200/198 , H03F2200/204 , H03F2200/451
Abstract: A power amplifier structure having: a power divider for dividing power in a signal fed to an input port between a pair of output ports. Each one of a pair of amplifiers has: an input coupled to a corresponding one of the pair of power divider output ports; and an output. A power combiner is provided. Signals at the power divider output ports are fed to the inputs of the pair of amplifiers in a forward direction and then pass through the amplifiers in the forward direction towards the outputs of the pair of amplifiers. Connectors direct the signals at the amplifier outputs to the power combiners, the signal then passing through the power combiner to an output port in a direction opposite to the forward direction.
Abstract translation: 一种功率放大器结构，具有：功率分配器，用于分配馈送到一对输出端口之间的输入端口的信号中的功率。 一对放大器中的每一个具有：耦合到所述一对功率分配器输出端口中的相应一个的输入端; 和输出。 提供功率组合器。 功率分配器输出端口处的信号以正向馈送到放大器对的输入端，然后沿着正向通过放大器朝向该对放大器的输出端。 连接器将放大器输出端的信号引导到功率组合器，然后信号通过功率组合器以与正向相反的方向通过输出端口。
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公开(公告)号：US20250107006A1
公开(公告)日：2025-03-27
申请号：US18471385
申请日：2023-09-21
Applicant: Raytheon Company
Inventor： Angelo M. Puzella , Philip M. Henault , Alexander B. Brailovsky
Abstract: A printed circuit board comprises a support structure, a conductive layer operably coupled to the support structure, a mask structure formed on the conductive layer, and a cover layer. The conductive layer comprises first and second portions of conductive material separated by a gap that defines a spacing between the first and second portions that does not contain conductive material. The mask structure defines first and second regions on the conductive layer. The first region is enclosed by a first boundary defined by the mask structure and includes the gap. The second region lies outside of the first boundary. The cover layer is sized to fit within the first region and comprises a laminatible insulating material that flows within the first region during lamination. During lamination, the first boundary prevents the laminatible insulating material from flowing into the second region, and the laminatible insulating material flows to fill the gap.
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公开(公告)号：US11558957B2
公开(公告)日：2023-01-17
申请号：US16900390
申请日：2020-06-12
Applicant: Raytheon Company , THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
Inventor： David H. Altman , Christopher H. Peters , Gregory P. Schaefer , Philip M. Henault , Darin J. Sharar
Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.
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