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1.发明申请公开(公告)号：US20170339779A1
公开(公告)日：2017-11-23
申请号：US15158399
申请日：2016-05-18
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
CPC classification number: H05K1/0204 , H01L23/4275 , H01L23/4338 , H05K1/181 , H05K3/34 , H05K2201/10227 , H05K2201/10507
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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2.发明申请公开(公告)号：US20190261502A1
公开(公告)日：2019-08-22
申请号：US16399754
申请日：2019-04-30
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
IPC: H05K1/02 , H05K1/18 , H05K3/34 , H01L23/433 , H01L23/427
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers.A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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公开(公告)号：US20160105963A1
公开(公告)日：2016-04-14
申请号：US14509393
申请日：2014-10-08
Applicant: Raytheon Company
Inventor： Robert S. Isom , Justin Kasemodel , James M. Elliott
CPC classification number: H05K1/14 , H01Q1/50 , H05K1/0213 , H05K1/144 , H05K1/145 , H05K3/366 , H05K2201/10098
Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.
Abstract translation: 提供一种用于连接第一和第二电路板的转换装置。 转换装置包括具有边缘和在边缘之间限定的长度的光束，沿着光束的长度运行的光束电路和设置在光束边缘处的连接，以将光束电路与第一和第二电路板的相应电路连接 各自的内部，相对的表面。
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Patent Agency Ranking
4.发明授权公开(公告)号：US10887978B2
公开(公告)日：2021-01-05
申请号：US16399754
申请日：2019-04-30
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
IPC: H05K7/20 , H05K1/02 , H01L23/427 , H01L23/433 , H05K1/18 , H05K3/34
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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公开(公告)号：US09468103B2
公开(公告)日：2016-10-11
申请号：US14509393
申请日：2014-10-08
Applicant: Raytheon Company
Inventor： Robert S. Isom , Justin Kasemodel , James M. Elliott
CPC classification number: H05K1/14 , H01Q1/50 , H05K1/0213 , H05K1/144 , H05K1/145 , H05K3/366 , H05K2201/10098
Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.
Abstract translation: 提供一种用于连接第一和第二电路板的转换装置。 转换装置包括具有边缘和在边缘之间限定的长度的光束，沿着光束的长度运行的光束电路和设置在光束边缘处的连接，以将光束电路与第一和第二电路板的相应电路连接 各自的内部，相对的表面。
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公开(公告)号：US12032008B2
公开(公告)日：2024-07-09
申请号：US17175512
申请日：2021-02-12
Applicant: Raytheon Company
Inventor： Christopher J. Fisher , Amanda Couch , John Sherrill , Justin Kasemodel , Justin Stroup , Allen Kelly
CPC classification number: G01R29/0878 , H01Q13/02 , Y10T29/5313
Abstract: A system for contactless testing of radio frequency apertures is provided. The system comprises a fixture having a fixture mount operable to be received in a fixture receiver of a robotic system, and a vector network analyzer (“VNA”) supported by the fixture. A radiating antenna is supported by the fixture, and is operable to be connected to the VNA via a cable. Upon movement of the fixture via the robotic system, the VNA, the radiating antenna, and the cable maintain a static positional relationship relative to one another.
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公开(公告)号：US20220260623A1
公开(公告)日：2022-08-18
申请号：US17175512
申请日：2021-02-12
Applicant: Raytheon Company
Inventor： Christopher J. Fisher , Amanda Couch , John Sherrill , Justin Kasemodel , Justin Stroup , Allen Kelly
Abstract: A system for contactless testing of radio frequency apertures is provided. The system comprises a fixture having a fixture mount operable to be received in a fixture receiver of a robotic system, and a vector network analyzer (“VNA”) supported by the fixture. A radiating antenna is supported by the fixture, and is operable to be connected to the VNA via a cable. Upon movement of the fixture via the robotic system, the VNA, the radiating antenna, and the cable maintain a static positional relationship relative to one another.
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8.发明授权公开(公告)号：US10292255B2
公开(公告)日：2019-05-14
申请号：US15158399
申请日：2016-05-18
Applicant: Raytheon Company
Inventor： Brian W. Johansen , Justin Kasemodel , James M. Elliott
IPC: H05K1/02 , H01L23/427 , H01L23/433 , H05K1/18 , H05K3/34
Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.
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