公开(公告)号：US20110244264A1

公开(公告)日：2011-10-06

申请号：US13133967

申请日：2009-11-19

申请人： Reiner Anton ,  Brigritte Heinecke ,  Michael Ott ,  Christian Ressel

发明人： Reiner Anton ,  Brigritte Heinecke ,  Michael Ott ,  Christian Ressel

IPC分类号： B32B5/18 ,  B23K1/00 ,  B32B3/26 ,  F16B5/07

CPC分类号： B23K1/0018 ,  B23K3/08 ,  B23K26/03 ,  B23K26/211 ,  B23K26/702 ,  B23K37/06 ,  B23K2101/001 ,  B32B3/26 ,  B32B3/30 ,  B32B15/00 ,  B32B15/01 ,  F01D5/005 ,  F05D2230/22 ,  F05D2230/237 ,  F05D2250/131 ,  F05D2250/70 ,  F05D2260/36 ,  Y02T50/67 ,  Y10T428/12229 ,  Y10T428/12361 ,  Y10T428/12375 ,  Y10T428/12382 ,  Y10T428/12479 ,  Y10T428/12486 ,  Y10T428/12493 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/249953 ,  Y10T428/249981

摘要： The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mould that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.

摘要翻译： 使用被称为PSP的预烧结焊盘经常在烧结材料中的各个晶粒之间以及烧结体和基底材料之间没有连续的，内聚的焊接连接的情况下进行。 预制的，穿孔的，多孔的或钻孔的板或多孔的海绵状层状材料的工艺焊接，其可以作为多个瓷砖或作为单独的多孔，钻孔或穿孔的嵌入元件全面地铺设在基底元件上，设计成轮廓关闭 设置在基材的凹部上。 为此，所选择的板材可以机械地等于基材，或者为了组件插入件的特定要求而被去掉。 焊料可以被特定的可扩散，熔点降低的部件抵消。 还提供了一种具有开放，连续的孔隙度使得熔融或流体焊料可以从一个表面流过到另一个表面的模具。