公开(公告)号：US08597989B2

公开(公告)日：2013-12-03

申请号：US13726326

申请日：2012-12-24

Applicant: Renesas Electronics Corporation

Inventor： Makio Okada ,  Hidetoshi Kuraya ,  Toshio Tanabe ,  Yoshinori Fujisaki ,  Kotaro Arita

IPC: H01L21/44

CPC classification number: H01L21/56 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752

Abstract: The yield of semiconductor devices is improved. In an upper die of a resin molding die including a pair of the upper die and a lower die, by lengthening the radius of the cross section of an inner peripheral surface of a second corner part facing an injection gate of a cavity more than that of the other corner part, a void contained in a resin in resin injection can be pushed out into an air vent without allowing the void to remain in the second corner part of the cavity. Consequently, the occurrence of the void in the cavity can be prevented and then the occurrence of the appearance defect of the semiconductor device can be prevented.

Abstract translation: 提高了半导体器件的产量。 在包括一对上模和下模的树脂模制模具的上模中，通过使面向腔的注入口的第二角部的内周面的横截面的半径比 另一个角部分，树脂注射中树脂中所含的空隙可以被推出到通气孔中，而不会使空隙残留在空腔的第二角部。 因此，可以防止在空腔中出现空隙，从而可以防止半导体器件出现缺陷。