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公开(公告)号：US06906539B2
公开(公告)日：2005-06-14
申请号：US09905426
申请日：2001-07-14
CPC分类号： G01R1/07314 , Y10T29/49204
摘要： A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.
摘要翻译： 一种探针卡装置，包括具有接近于硅的热膨胀特性的刚性基底，层压有具有激光图案化引线和接触垫的柔性膜，以及包括从两个主表面突出的贵金属的接触元件，第一次反射紧密间隔的芯片焊盘 ，并且第二对准到更宽的间隔开的探针卡焊盘，提供精确和可重复的，低成本的快速制造的探针接触装置，其能够接触电子优化的任何区域阵列或周边位置中的非常高密度的接合焊盘， 并保持容易。
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公开(公告)号：US06720780B2
公开(公告)日：2004-04-13
申请号：US09921169
申请日：2001-08-02
IPC分类号： G01R3102
CPC分类号： G01R1/07378
摘要： A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.
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公开(公告)号：US06636063B2
公开(公告)日：2003-10-21
申请号：US09968963
申请日：2001-10-02
IPC分类号： G01R3102
CPC分类号： G01R1/06744 , G01R1/07342 , G01R3/00
摘要： A probe card having reliable “micro probe” contacts which include a base and an angled probe tip fabricated as a single unit from a thin sheet of a conductive metal having high tensile and yield strength, and coated with a noble metal. The micro probes are secured into precisely dimensioned, and positioned locations on the card, and are electrically connected to traces on the card. Design of the micro probes includes not only the base and probe tip, but also locking features, a stand-off to prevent over compression, and a necked down stem feature for release from the support strap used in transporting and plating during the manufacturing processes.
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公开(公告)号：US20050140382A1
公开(公告)日：2005-06-30
申请号：US11067346
申请日：2005-02-23
申请人： Lester Wilson , Reynaldo Rincon , Jerry Broz , Richard Arnold
发明人： Lester Wilson , Reynaldo Rincon , Jerry Broz , Richard Arnold
CPC分类号： G01R1/07314 , Y10T29/49204
摘要： A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.
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公开(公告)号：US06553661B2
公开(公告)日：2003-04-29
申请号：US09754834
申请日：2001-01-04
申请人： Richard W. Arnold , Lester Wilson , James Forster
发明人： Richard W. Arnold , Lester Wilson , James Forster
IPC分类号： H05K302
CPC分类号： G01R1/0408 , G01R1/073 , G01R3/00 , Y10T29/49117 , Y10T29/49121 , Y10T29/49128 , Y10T29/49147 , Y10T29/49151 , Y10T29/49156 , Y10T29/49167
摘要： A test structure that is readily and inexpensively configurable to interface with dies having different bond pad configurations is achieved by providing a blank test membrane having a conductive coating or a matrix of conductive lines formed thereon. Once a die bond pad configuration is known, the test membrane can be configured for the die bond pads by using a laser under software control to define connection pads correlating to the die bond pads and also to define interconnecting conductive traces from the connecting pads to contact pads that can be connected to test equipment. In one embodiment, the laser operates to ablate a continuous conductive coating, so as to form conductive pads and traces. In another embodiment, the laser is used to cut various lines in a matrix of conductive lines, so as to define conductive paths from the bond pads to the contact pads for connection to the test equipment.
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