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公开(公告)号：US06906539B2
公开(公告)日：2005-06-14
申请号：US09905426
申请日：2001-07-14
CPC分类号： G01R1/07314 , Y10T29/49204
摘要： A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.
摘要翻译： 一种探针卡装置，包括具有接近于硅的热膨胀特性的刚性基底，层压有具有激光图案化引线和接触垫的柔性膜，以及包括从两个主表面突出的贵金属的接触元件，第一次反射紧密间隔的芯片焊盘 ，并且第二对准到更宽的间隔开的探针卡焊盘，提供精确和可重复的，低成本的快速制造的探针接触装置，其能够接触电子优化的任何区域阵列或周边位置中的非常高密度的接合焊盘， 并保持容易。
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公开(公告)号：US06720780B2
公开(公告)日：2004-04-13
申请号：US09921169
申请日：2001-08-02
IPC分类号： G01R3102
CPC分类号： G01R1/07378
摘要： A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.
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公开(公告)号：US06720574B2
公开(公告)日：2004-04-13
申请号：US09986341
申请日：2001-11-08
IPC分类号： H01L2358
CPC分类号： G01R1/0483 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/4847 , H01L2224/49109 , H01L2225/0651 , H01L2225/06527 , H01L2225/06572 , H01L2225/06582 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/16195 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An apparatus for testing a semiconductor die and the method wherein there is provided a package having a cavity therein with a plurality of terminals in the package disposed at the periphery of the cavity. A semiconductor die to be tested and having a plurality of bond pads thereon is disposed in the cavity and an interconnecting layer having electrically conductive paths thereon is also disposed in the cavity, each of the paths having first and second spaced apart regions thereon, the first region of each path being aligned with and contacting a bond pad. An interconnection is provided between the second spaced apart region of each of the paths and one of the plurality of terminals. The second spaced apart region of each of the paths is preferably a bump aligned with and contacting one of the plurality of terminals. A compliant layer is preferably disposed over the interconnecting layer and provides a force causing engagement of at least the first spaced apart regions and the bond pads. The first region is preferably a compliant bump probe tip having a first predetermined height above the layer and includes a standoff on the layer having a second predetermined height above the layer less than the first height.
摘要翻译： 一种用于测试半导体管芯的设备及其方法，其中提供了一种其中具有空腔的封装，该封装中的多个端子设置在空腔周边。 待测试并且在其上具有多个接合焊盘的半导体管芯设置在空腔中，并且其上具有导电路径的互连层也设置在空腔中，每个路径上具有第一和第二间隔开的区域，第一 每个路径的区域与接合焊盘对准并接触。 在每个路径的第二间隔开的区域和多个端子中的一个之间提供互连。 每个路径的第二间隔开的区域优选地是与多个端子之一对准并接触多个端子之一的凸块。 优选地，柔性层设置在互连层上方并且提供导致至少第一间隔开的区域和接合焊盘的接合的力。 第一区域优选地是具有在层上方的第一预定高度的柔顺凸起探针尖端，并且包括在该层上方的具有小于第一高度的第二预定高度的支座。
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公开(公告)号：US07898275B1
公开(公告)日：2011-03-01
申请号：US09164580
申请日：1998-10-01
CPC分类号： G01R1/0483 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/4847 , H01L2224/49109 , H01L2225/0651 , H01L2225/06527 , H01L2225/06572 , H01L2225/06582 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/16195 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An apparatus for testing a semiconductor die and the method wherein there is provided a package having a cavity therein with a plurality of terminals in the package disposed at the periphery of the cavity. A semiconductor die to be tested and having a plurality of bond pads thereon is disposed in the cavity and an interconnecting layer having electrically conductive paths thereon is also disposed in the cavity, each of the paths having first and second spaced apart regions thereon, the first region of each path being aligned with and contacting a bond pad. An interconnection is provided between the second spaced apart region of each of the paths and one of the plurality of terminals. The second spaced apart region of each of the paths is preferably a bump aligned with and contacting one of the plurality of terminals. A compliant layer is preferably disposed over the interconnecting layer and provides a force causing engagement of at least the first spaced apart regions and the bond pads. The first region is preferably a compliant bump probe tip having a first predetermined height above the layer and includes a standoff on the layer having a second predetermined height above the layer less than the first height.
摘要翻译： 一种用于测试半导体管芯的设备及其方法，其中提供了一种其中具有空腔的封装，该封装中的多个端子设置在空腔周边。 待测试并且在其上具有多个接合焊盘的半导体管芯设置在空腔中，并且其上具有导电路径的互连层也设置在空腔中，每个路径上具有第一和第二间隔开的区域，第一 每个路径的区域与接合焊盘对准并接触。 在每个路径的第二间隔开的区域和多个端子中的一个之间提供互连。 每个路径的第二间隔开的区域优选地是与多个端子之一对准并接触多个端子之一的凸块。 优选地，柔性层设置在互连层上方并且提供导致至少第一间隔开的区域和接合焊盘的接合的力。 第一区域优选地是具有在层上方的第一预定高度的柔顺凸起探针尖端，并且包括在该层上方的具有小于第一高度的第二预定高度的支座。
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公开(公告)号：US06276563B1
公开(公告)日：2001-08-21
申请号：US09416324
申请日：1999-10-12
申请人： Joe M. Saldana , Andrew D. Alexander, II , Michael J. Pomeroy , Richardo Garza , Richard W. Arnold, Jr. , James L. McGovern
发明人： Joe M. Saldana , Andrew D. Alexander, II , Michael J. Pomeroy , Richardo Garza , Richard W. Arnold, Jr. , James L. McGovern
IPC分类号： B65G4712
CPC分类号： H05K13/028
摘要： A bulk component feeder is provided for delivering components contained with a bulk cassette. The feeder includes a feeder housing defining a component cassette receiving area. The receiving area includes a cassette mounting means for registration with the cassette, and the housing defines an opening for receiving components from the cassette. A gate slidable within the cassette receiving area interfaces with a mounting means, and the gate is slidable to cover the opening in a closed position and uncover the opening in an open position upon attachment of the cassette to the housing. A spring is used to bias the gate toward the closed position, and a latch is mounted to the housing and is engagable with the gate to prevent sliding of the gale toward the open position and thereby prevent installation of the cassette.
摘要翻译： 提供散装部件馈送器用于传送包含大容量盒的部件。 馈送器包括限定组件盒接收区域的馈送器壳体。 接收区域包括用于与盒对准的盒安装装置，并且壳体限定用于从盒子接收部件的开口。 在盒接收区域内可滑动的门与安装装置相接合，并且门可滑动以在关闭位置覆盖开口，并且在将盒附接到壳体时将开口露出在打开位置。 弹簧用于将门偏压到关闭位置，并且闩锁安装到壳体并且可与门接合以防止大风向着打开位置的滑动，从而防止盒的安装。
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6.发明授权
公开(公告)号：US5591649A
公开(公告)日：1997-01-07
申请号：US375462
申请日：1995-01-19
IPC分类号： H01L23/58 , H01L21/603 , H01L21/68 , H01L23/32
CPC分类号： H01L22/32 , Y10T29/41 , Y10T29/53022 , Y10T29/53274
摘要： A removable tab process whereby tabs (7) are affixed to the pads (3) by initially having the bonding surface as flat as possible so that bonding pressures from pad to pad are relatively uniform. Bonding is performed with the pressure applied to the pads being such that the tabs can later be easily removed without damage to the die pads, yet sufficiently strong so that the tabs do not come loose during burn in and testing. A bond strength pull between about 5 and about 40 grams per pad is appropriate for this purpose. The tabs are removed by placing the tested die (1) and attached tabs in a fixture (11) and providing a tool (31) dimensioned and moved along a path (13, 15, 17, 19) whereby each of the tabs is serially removed with the pressure applied to each tab to provide removal being preferably no greater than 40 grams. In this manner, since only one tab is removed at a time, there is no requirement that the extraction tool provide a great force to the die, thus minimizing the possibility of a greater than acceptable force being applied to any one tab for removal.
摘要翻译： 一个可移除的标签过程，其中通过最初使接合表面尽可能平坦地将接片（7）固定到焊盘（3），使得从焊盘到焊盘的接合压力相对均匀。 在施加到焊盘上的压力下进行接合，使得接片可以随后被容易地移除而不损坏管芯焊盘，但是足够坚固，使得突片在燃烧和测试期间不会松动。 每个垫的约5至约40克之间的粘合强度拉力适用于此目的。 通过将测试的模具（1）和附接的凸片放置在固定装置（11）中并提供沿着路径（13,15,17,19）定尺寸和移动的工具（31）来移除凸片，由此每个凸片是串联的 在施加到每个突片上的压力下移除以提供优选不大于40克的去除。 以这种方式，由于一次仅去除一个突片，所以不要求提取工具对模具提供很大的力，因此最小化将大于可接受的力施加到任何一个突出部用于移除的可能性。
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公开(公告)号：US07026833B2
公开(公告)日：2006-04-11
申请号：US11213236
申请日：2005-08-26
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R1/07314
摘要： A probe card assemblage for simultaneously testing one or more integrated circuit chips including an interposer having on one surface a plurality of protruding contact elements for electrically contacting one or more chips of a wafer positioned atop a layer of compliant material, and arrayed in a pattern corresponding to a chip pads, a series of conductive vias through the electrically insulating interposer which connect the chip contact elements with an arrangement of leads terminating in a universal arrangement of connectors on the second surface, and a probe card with connectors mating to those on the interposer. The connectors on the interposer is secured are secured to those on the probe card, thereby providing a vertical probe assemblage which makes use of ultrasonic energy to minimize scrub or over travel. The universal probe card is specific to a tester configuration and common to a family of circuits to be tested.
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公开(公告)号：US06636063B2
公开(公告)日：2003-10-21
申请号：US09968963
申请日：2001-10-02
IPC分类号： G01R3102
CPC分类号： G01R1/06744 , G01R1/07342 , G01R3/00
摘要： A probe card having reliable “micro probe” contacts which include a base and an angled probe tip fabricated as a single unit from a thin sheet of a conductive metal having high tensile and yield strength, and coated with a noble metal. The micro probes are secured into precisely dimensioned, and positioned locations on the card, and are electrically connected to traces on the card. Design of the micro probes includes not only the base and probe tip, but also locking features, a stand-off to prevent over compression, and a necked down stem feature for release from the support strap used in transporting and plating during the manufacturing processes.
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9.发明授权Soft handling process tooling for low and medium volume known good die product 有权软处理工艺用于中低体积已知的好模具产品公开(公告)号：US06209532B1
公开(公告)日：2001-04-03
申请号：US09500519
申请日：2000-02-09
IPC分类号： B28D104
CPC分类号： H01L21/6838 , B28D5/0082 , B28D5/0094 , H01L21/67144
摘要： A method of transferring a semiconductor die from a wafer containing a plurality of semiconductor dice. There is provided a semiconductor wafer having a top side and an opposing bottom side and a plurality of dice formed therein, each die containing a portion of the top side and the opposing bottom side. The wafer is removably secured to a support and the wafer is operated upon to form individual dice on the support. The support is preferably a flexible film. A tool is disposed between the support and the bottom side of a the die by creating a vacuum between the tool and the bottom side to cause adherence of the die to the tool and the die is removed from the support with the tool and placed in a die carrier with the top side facing the carrier and the vacuum is then released. The film, when flexible, is stretched to separate the dice from each other and create streets between adjacent dice so that the tool can be disposed under the die from the street. The tool preferably includes an inclined surface with a port exiting at the surface extending through and out of the tool, the vacuum being created at the port and the inclined surface contacting the bottom side of the die. Prior to operation with the tool, a lifting member can impinge against the die bottom through the support to separate a portion of the die from the support, the tool entering beneath the die at the portion of the die removed from the support. The carrier preferably includes a carrier base having a plurality of vacuum ports and an air transmissive lint-free layer over the vacuum ports with the top side of the die abutting the lint-free layer, the die being disposed over one of the vacuum ports.
摘要翻译： 从包含多个半导体晶片的晶片转移半导体管芯的方法。 提供了具有顶侧和相对的底侧以及形成在其中的多个骰子的半导体晶片，每个模包含顶侧和相对的底侧的一部分。 晶片可移除地固定到支撑件上，并且晶片被操作以在支撑件上形成单独的骰子。 该支撑体优选为柔性膜。 通过在工具和底侧之间产生真空，将模具设置在模具的支撑件和底侧之间，以使模具粘附到工具上，并且使用工具将模具从支撑件移除并放置在 模具载体，其顶侧面向载体，然后释放真空。 这种胶片在柔软的时候被拉伸，以将骰子彼此分离，并在相邻的骰子之间形成街道，以便该工具可以从街道上放置在模具下方。 该工具优选地包括倾斜表面，其中在表面处离开的端口延伸穿过和离开工具，在端口处产生真空，并且倾斜表面接触模具的底侧。 在使用该工具进行操作之前，提升构件可以通过支撑件撞击模具底部，以将模具的一部分与支撑件分离，该模具在模具的下方进入模具的从支撑件移除的部分。 载体优选地包括具有多个真空端口的载体基体和真空端口上的空气传输无绒层，其中模具的顶侧邻接无绒层，模具设置在真空端口之一上。
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10.发明授权Tool and fixture for the removal of tab leads bonded to semiconductor die pads 失效用于去除接合到半导体管芯焊盘的接头引线的工具和夹具
公开(公告)号：US5649981A
公开(公告)日：1997-07-22
申请号：US706768
申请日：1996-09-23
CPC分类号： H01L22/32 , Y10T29/41 , Y10T29/53022 , Y10T29/53274
摘要： An apparatus for use in a removable tab procedure whereby tabs (7) are affixed to the pads (3) by initially having the bonding surface as flat as possible so that bonding pressures from pad to pad are relatively uniform. Bonding is preformed with the pressure applied to the pads being such that the tabs can later be easily removed without damage to the die pads, yet sufficiently strong so that the tabs do not come loose during burn in and testing. A bond strength pull between about 5 and about 40 grams per pad is appropriate for this purpose. The tabs are removed by placing the tested die (1) and attached tabs in a fixture (11) and providing a tool (31) dimensioned and moved along a path (13, 15, 17, 19) whereby each of the tabs is serially removed with the pressure applied to each tab to provide removal being preferably no greater than 40 grams. In this manner, since only one tab is removed at a time, there is no requirement that the extraction tool provide a great force to the die, thus minimizing the possibility of a greater than acceptable force being applied to any one tab for removal.
摘要翻译： 一种用于可移除的标签过程的装置，其中通过最初使粘结表面尽可能平坦地将凸片（7）固定到垫（3），使得从垫到垫的粘合压力相对均匀。 通过施加到焊盘的压力来进行粘合，使得接片可以稍后被容易地去除而不损坏管芯焊盘，但是足够坚固，使得突片在燃烧和测试期间不会松动。 每个垫的约5至约40克之间的粘合强度拉力适用于此目的。 通过将测试的模具（1）和附接的凸片放置在固定装置（11）中并提供沿着路径（13,15,17,19）定尺寸和移动的工具（31）来移除凸片，由此每个凸片是串联的 在施加到每个突片上的压力下移除以提供优选不大于40克的去除。 以这种方式，由于一次仅去除一个突片，所以不要求提取工具对模具提供很大的力，因此最小化将大于可接受的力施加到任何一个突出部用于移除的可能性。
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