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1.
公开(公告)号:US06306528B1
公开(公告)日:2001-10-23
申请号:US09311812
申请日:1999-05-13
申请人: Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
发明人: Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
IPC分类号: B32B1800
CPC分类号: C04B41/009 , C04B41/5133 , C04B41/88 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H05K1/0306 , H05K1/092 , Y10T428/265 , C04B41/4539 , C04B41/4556 , C04B41/4578 , C04B41/5032 , C04B41/526 , C04B35/581 , H01L2924/00
摘要: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.
摘要翻译: 用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。 在氮化铝中,这些缺陷可能与液体烧结助剂的分解有关。 在该实验中,金属化的独特添加防止了某些陶瓷缺陷的形成。 我们的方法涉及在现有过程中使用的独特组合。
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2.
公开(公告)号:US06200373B1
公开(公告)日:2001-03-13
申请号:US09311811
申请日:1999-05-13
申请人: Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
发明人: Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
IPC分类号: B32B1700
CPC分类号: C04B41/009 , C04B41/5133 , C04B41/88 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H05K1/0306 , H05K1/092 , Y10T428/265 , C04B41/4539 , C04B41/4556 , C04B41/4578 , C04B41/5032 , C04B41/526 , C04B35/581 , H01L2924/00
摘要: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.
摘要翻译: 用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。 在氮化铝中,这些缺陷可能与液体烧结助剂的分解有关。 在该实验中,金属化的独特添加防止了某些陶瓷缺陷的形成。 我们的方法涉及在现有过程中使用的独特组合。
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3.
公开(公告)号:US6004624A
公开(公告)日:1999-12-21
申请号:US887375
申请日:1997-07-02
申请人: Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
发明人: Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
CPC分类号: C04B41/009 , C04B41/5133 , C04B41/88 , H01L23/15 , C04B2111/00844 , H01L2924/0002 , H05K1/0306 , H05K1/092 , Y10T428/265
摘要: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.
摘要翻译: 用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。 在氮化铝中,这些缺陷可能与液体烧结助剂的分解有关。 在该实验中,金属化的独特添加防止了某些陶瓷缺陷的形成。 我们的方法涉及在现有过程中使用的独特组合。
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