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    COOLING DEVICE FOR A POWER MODULE, AND A RELATED METHOD THEREOF
    1.
    发明申请
    COOLING DEVICE FOR A POWER MODULE, AND A RELATED METHOD THEREOF 有权
    用于功率模块的冷却装置及其相关方法

    公开(公告)号：US20120327603A1

    公开(公告)日：2012-12-27

    申请号：US13168030

    申请日：2011-06-24

    申请人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski ,  William Dwight Gerstler ,  Xiaochun Shen

    发明人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski ,  William Dwight Gerstler ,  Xiaochun Shen

    IPC分类号： H05K7/20 ,  B23P19/00 ,  F28F9/02

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  Y10T29/49817 ,  H01L2924/00

    摘要： A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.

    摘要翻译： 公开了一种具有通过基板设置在基板上的电子模块的功率模块的冷却装置。 冷却装置包括具有至少一个冷却段的散热板。 冷却段包括用于进入冷却介质的入口增压室，多个入口歧管通道，多个出口歧管通道和出口增压室。 多个入口歧管通道正交地连接到入口气室，用于从入口通风室接收冷却介质。 多个出口歧管通道平行于入口歧管通道设置。 出口增压室正交地连接到多个出口歧管通道，用于排出冷却介质。 多个毫通道与入口和出口歧管通道正交地布置在基板中。 多个毫通道将冷却介质从多个入口歧管通道引导到多个出口歧管通道。

    Cooling device for a power module, and a related method thereof
    2.
    发明授权
    Cooling device for a power module, and a related method thereof 有权
    电源模块的冷却装置及其相关方法

    公开(公告)号：US08982558B2

    公开(公告)日：2015-03-17

    申请号：US13168030

    申请日：2011-06-24

    申请人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski ,  William Dwight Gerstler ,  Xiaochun Shen

    发明人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski ,  William Dwight Gerstler ,  Xiaochun Shen

    IPC分类号： H05K7/20 ,  H01L23/473

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  Y10T29/49817 ,  H01L2924/00

    摘要： A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.

    摘要翻译： 公开了一种具有通过基板设置在基板上的电子模块的功率模块的冷却装置。 冷却装置包括具有至少一个冷却段的散热板。 冷却段包括用于进入冷却介质的入口增压室，多个入口歧管通道，多个出口歧管通道和出口增压室。 多个入口歧管通道正交地连接到入口气室，用于从入口通风室接收冷却介质。 多个出口歧管通道平行于入口歧管通道设置。 出口增压室正交地连接到多个出口歧管通道，用于排出冷却介质。 多个毫通道与入口和出口歧管通道正交地布置在基板中。 多个毫通道将冷却介质从多个入口歧管通道引导到多个出口歧管通道。

    MILLICHANNEL HEAT SINK, AND STACK AND APPARATUS USING THE SAME
    3.
    发明申请
    MILLICHANNEL HEAT SINK, AND STACK AND APPARATUS USING THE SAME 审中-公开
    MILLICHANNEL热水槽，堆叠和使用它的装置

    公开(公告)号：US20100175857A1

    公开(公告)日：2010-07-15

    申请号：US12354386

    申请日：2009-01-15

    申请人： William Dwight Gerstler ,  Joseph Lucian Smolenski ,  Richard Alfred Beaupre ,  Stephen Adam Solovitz

    发明人： William Dwight Gerstler ,  Joseph Lucian Smolenski ,  Richard Alfred Beaupre ,  Stephen Adam Solovitz

    IPC分类号： H05K7/20 ,  F28D15/00 ,  F28F3/12 ,  F28F13/06

    CPC分类号： F28D15/00 ,  F28F3/12 ,  F28F13/185 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling device comprises an upper surface configured to contact the baseplate, an inlet manifold configured to receive a coolant, an outlet manifold configured to exhaust the coolant, and at least one set of millichannels in the upper surface. The at least one set of the millichannels defines at least one heat sink region with at least one groove about one or more millichannels in the respective heat sink region with the groove configured to receive a seal. The at least one heat sink region establishes direct contact of the coolant with the baseplate, and the millichannels are configured to receive the coolant from the inlet manifold and to deliver the coolant to the outlet manifold. An apparatus and a stack are also presented.

    摘要翻译： 冷却装置包括构造成接触基板的上表面，构造成接收冷却剂的入口歧管，构造成排出冷却剂的出口歧管以及上表面中的至少一组毫通道。 所述至少一组所述毫通道限定至少一个散热区域，所述至少一个散热区域具有围绕相应散热区域中的一个或多个毫通道的至少一个凹槽，所述凹槽被配置为接收密封。 所述至少一个散热区域建立冷却剂与基板的直接接触，并且所述毫通道构造成从所述入口歧管接收所述冷却剂并将所述冷却剂输送到所述出口歧管。 还提供了一种装置和堆叠。

    Power converting apparatus having improved electro-thermal characteristics
    6.
    发明授权
    Power converting apparatus having improved electro-thermal characteristics 有权
    具有改善的电热特性的电力转换装置

    公开(公告)号：US08675379B2

    公开(公告)日：2014-03-18

    申请号：US13204834

    申请日：2011-08-08

    申请人： Joseph Lucian Smolenski ,  Michael Schutten ,  Eladio Clemente Delgado ,  Richard Alfred Beaupre

    发明人： Joseph Lucian Smolenski ,  Michael Schutten ,  Eladio Clemente Delgado ,  Richard Alfred Beaupre

    IPC分类号： H05K7/20 ,  H02M7/5387

    CPC分类号： H01L25/16 ,  H01L2924/0002 ,  H02M7/003 ,  H05K7/1432 ,  H01L2924/00

    摘要： A power-converting apparatus, such as a power module, may include a base plate (16), a first direct current (DC) bus and a second DC bus (22, 24). A power semiconductor component (18, 20) may be electrically coupled to one of the buses, and may be disposed on a substrate (12, 14) physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor (50) may be coupled across the first and second DC buses, and at least second and third capacitors (52) may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path. Capacitors (50, 52) may each be located inside the power module to establish circuit connections sufficiently proximate to the first power semiconductor component to reduce a formation of parasitic inductances, and further may each be located physically apart from the substrate and thus not exposed to the heat flux.

    摘要翻译： 诸如功率模块的电力转换装置可以包括基板（16），第一直流（DC）总线和第二DC总线（22,24）。 功率半导体部件（18,20）可以电耦合到总线中的一个，并且可以设置在物理耦合到基板的基板（12,14）上。 功率半导体部件可以由高温，宽带隙材料制成，并且基板可以基于功率半导体部件的工作温度暴露于热通量。 至少第一电容器（50）可以跨越第一和第二DC总线耦合，并且至少第二和第三电容器（52）可以分别耦合在第一和第二总线中的相应的第一和第二总线上，并且交流（AC）返回 路径。 电容器（50,52）可以各自位于功率模块内部，以建立足够靠近第一功率半导体部件的电路连接，以减少寄生电感的形成，并且还可以分别位于与衬底物理分开的位置，从而不暴露于 热通量。

    Busbar for power conversion applications
    7.
    发明授权
    Busbar for power conversion applications 有权
    母线用于电力转换应用

    公开(公告)号：US08772634B2

    公开(公告)日：2014-07-08

    申请号：US13036750

    申请日：2011-02-28

    申请人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski

    发明人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski

    IPC分类号： H05K9/00

    CPC分类号： H02G5/005 ,  H02M7/003

    摘要： A busbar for power conversion applications that includes two planar conductors that have terminal locations; a first planar insulator located between the planar conductors; two impedances elements that are electrically connected to each of the planar conductors, wherein the impedance elements each extend in a plane that is non-coplanar from the planar conductors, further wherein the impedance elements are configured so as to define a gap between them; and a second planar insulator is located in the gap. A power conversion assembly that connects an energy source and a power switch to the busbar.

    摘要翻译： 用于功率转换应用的母线，包括具有端子位置的两个平面导体; 位于平面导体之间的第一平面绝缘体; 两个阻抗元件，其电连接到每个平面导体，其中所述阻抗元件各自在与所述平面导体非共面的平面中延伸，其中所述阻抗元件被配置为在它们之间限定间隙; 并且第二平面绝缘体位于间隙中。 将能量源和电源开关连接到汇流排的电力转换组件。

    BUSBAR FOR POWER CONVERSION APPLICATIONS
    8.
    发明申请
    BUSBAR FOR POWER CONVERSION APPLICATIONS 有权
    用于功率转换应用的母线

    公开(公告)号：US20120217032A1

    公开(公告)日：2012-08-30

    申请号：US13036750

    申请日：2011-02-28

    申请人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski

    发明人： Richard Alfred Beaupre ,  Joseph Lucian Smolenski

    IPC分类号： H02G5/00

    CPC分类号： H02G5/005 ,  H02M7/003

    摘要： A busbar for power conversion applications that includes two planar conductors that have terminal locations; a first planar insulator located between the planar conductors; two impedances elements that are electrically connected to each of the planar conductors, wherein the impedance elements each extend in a plane that is non-coplanar from the planar conductors, further wherein the impedance elements are configured so as to define a gap between them; and a second planar insulator is located in the gap. A power conversion assembly that connects an energy source and a power switch to the busbar is disclosed. The present invention has been described in terms of specific embodiment(s), and it is recognized that equivalents, alternatives, and modifications, aside from those expressly stated, are possible and within the scope of the appending claims.

    摘要翻译： 用于功率转换应用的母线，包括具有端子位置的两个平面导体; 位于平面导体之间的第一平面绝缘体; 两个阻抗元件，其电连接到每个平面导体，其中所述阻抗元件各自在与所述平面导体非共面的平面中延伸，其中所述阻抗元件被配置为在它们之间限定间隙; 并且第二平面绝缘体位于间隙中。 公开了将能量源和功率开关连接到母线的电力转换组件。 已经根据具体实施例描述了本发明，并且认识到除了明确说明的那些之外的等同物，替代方案和修改是可能的并且在所附权利要求的范围内。