摘要:
A set of tools is provided herein that produces useful, proven, and correct integrated semiconductor chips. Having as input either a customer's requirements for a chip, or a design specification for a partially manufactured semiconductor chip, the tools generate the RTL for control plane interconnect; memory composition, test, and manufacture; embedded logic analysis, trace interconnection, and utilization of spare resources on the chip; I/O qualification, JTAG, boundary scan, and SSO analysis; testable clock generation, control, and distribution; interconnection of all of the shared logic in a testable manner from a transistor fabric and/or configurable blocks in the slice. The input customer requirements are first conditioned by RTL analysis tools to quickly implement its logic. The slice definition and the RTL shell provides the correct logic for a set of logic interfaces for the design specification to connect. The tools share a common database so that logical interactions do not require multiple entries. The designs are qualified, tested, and verified by other tools. The tools further optimize the placement and timing of the blocks on the chip with respect to each other and with respect to placement on a board. The suite may be run as batch processes or can be driven interactively through a common graphical user interface. The tools also have an iterative mode and a global mode. In the iterative mode, one or more of the selected tools can generate the blocks or modify a design incrementally and then look at the consequences of the addition, or change. In the global mode, the semiconductor product is designed all at once in a batch process as above and then optimized altogether. This suite of generation tools generates design views including a qualified netlist for a foundry to manufacture.
摘要:
A method for creating constraints for integrated circuit design closure is provided. Design specifications are captured before a design flow is started. The design specifications are checked for compatibility with the design flow. The design specifications are stored in a database. Output transforms are applied to the design specifications to create orthogonal constraint sets which are tuned for both a specific tool and a positional use of the specific tool within the design flow.
摘要:
A standardized silicon platform chip has a substrate surface with an array of unconnected transistors that surround islands. The islands have circuit elements that are interconnectable within each island to form a plurality of varied circuit functions for each of the islands. The varied circuit functions include both application functions and clock functions. Interconnect layers are deposited over the substrate surface to interconnect the circuit elements within each island to complete the varied circuit functions. The varied circuit functions include varied levels of integration including at least gates, flip-flops, clock trees, and oscillators. The varied circuit functions are custom connectable to the array of unconnected transistors to form standard clock resources for the standardized silicon platform chip.
摘要:
A electronic design automation tool, apparatus, method, and program product by which design requirements for an intended semiconductor product and the resource definitions of a semiconductor platform are input. From the design requirements and the resource definitions, parameters specific to clocking are derived, e.g., clock property information, clock domain crossing information, and clock relationship specification. The tool and method embodied therein validates the clocking parameters of the design requirements with the resource definitions and invokes errors if the parameters are not realizable. Once the desired clocking parameters are consistent with the actual clocking parameters, correct physical optimization constraints and timing constraints are generated for the clocks. An iterative process can achieve correct and minimal clocking constraints.
摘要:
A method and computer program are disclosed for managing synchronous and asynchronous clock domain crossings that include steps of: (a) receiving as input an integrated circuit design; (b) identifying paths between synchronous clock domains and paths between asynchronous clock domains in the integrated circuit design; and (c) if a path between synchronous clock domains is defined as a false path in the integrated circuit design, then reporting a fatal violation.
摘要:
Programmable nanotube interconnect is disclosed. In one embodiment, a method includes forming a interconnect layer using a plurality of nanotube structures, and automatically altering a route of an integrated circuit based on an electrical current applied to at least one of the plurality of nanotube structures in the interconnect layer. Neighboring interconnect layers separated by planar vias may include communication lines that are perpendicularly oriented with respect to each of the neighboring interconnect layers. The nanotube structure may be chosen from a group comprising a polymer, carbon, and a composite material. A carbon nanotube film may be patterned in a metal layer to form the plurality of nanotube structures. A sputtered planar process may be performed across a trench of electrodes to create the carbon nanotube structures.
摘要:
Configurable power segmentation using a nanotube structure is disclosed. In one embodiment, a method includes patterning a nanotube structure adjacent to a transistor layer in an integrated circuit, and coupling a power region in the transistor layer to at least one power source based on a state of the nanotube structure. Nanotube material may be sputtered over a plurality of layers to form the nanotube structure. The nanotube structure may be curved to flex to a conductive surface when a current is applied to the nanotube structure. The power region may be coupled with at least two power sources that are concatenated together to provide cascaded current to the power region. One or more power regions in the integrated circuit may be enable based on the patterning the nanotube structure and the coupling of the power region to at least one power source.
摘要:
A sequential element having a master stage and a slave stage and a method of testing an IC having a scan chain and an IC. In one embodiment, the sequential element includes an input scan multiplexor configured to place the sequential element in a functional mode or a scan mode in response to a scan enable input and a scan out driver coupled to the slave stage and configured to provide a scan out signal when the sequential element is in the scan mode, the scan out driver coupled to an inverted scan enable input for a negative voltage supply.
摘要:
A system for RTL test insertion in an integrated circuit layout pattern includes a core module, a test wrapper, and a smart wrapper. The core module describes a function defined by logical elements, interconnections between logical elements, input pins and output pins. The test wrapper is adapted to encapsulate the core module and to create test pins representing the core module. The smart wrapper is adapted to encapsulate the test wrapper and to assign the test pins to a non-asserted state. The smart wrapper is adapted to place an assertion on one or more of the test pins for static or dynamic testing of the integrated circuit layout pattern.
摘要:
Programmable power management using a nanotube structure is disclosed. In one embodiment, a method includes coupling a nanotube structure of an integrated circuit to a conductive surface when a command is processed, and enabling a group of transistors of the integrated circuit based on the coupling the nanotube structure to the conductive surface. A current may be applied to the nanotube structure to couple the nanotube structure to the conductive surface. The nanotube structure may be formed from a material chosen from one or more of a polymer, carbon, and a composite material. The group of transistors may be enabled during an activation sequence of the integrated circuit. In addition, one or more transistors of the group of transistors may be disengaged from the one or more power sources (e.g., to minimize leakage) when the nanotube structure is decoupled from the conductive surface.