摘要:
In accordance with the invention, a method for customizing a one-time configurable integrated circuit to include a multi-time configurable structure is disclosed. Such a method includes, in one embodiment receiving a description of circuit functionality from a user for implementation in the one-time configurable device, where the functionality includes a portion that is designated by the user to be reconfigurable. A method in accordance with an embodiment of the invention then models a reconfigurable structure that has enough capacity to accommodate the designated functionality. Optionally, some embodiments of the invention add in more capacity than is required to implement the designated functionality to allow for future reprogramming. The method then embeds the reconfigurable structure in the one-time configurable device. In certain embodiments, the one-time configurable device can be a mask-programmed MBA, gate array, or standard cell, while the reconfigurable structure is a PLA or modified PLA.
摘要:
In accordance with the invention, a method for customizing a one-time configurable integrated circuit to include a multi-time configurable structure is disclosed. Such a method includes, in one embodiment receiving a description of circuit functionality from a user for implementation in the one-time configurable device, where the functionality includes a portion that is designated by the user to be reconfigurable. A method in accordance with an embodiment of the invention then models a reconfigurable structure that has enough capacity to accommodate the designated functionality. Optionally, some embodiments of the invention add in more capacity than is required to implement the designated functionality to allow for future reprogramming. The method then embeds the reconfigurable structure in the one-time configurable device. In certain embodiments, the one-time configurable device can be a mask-programmed MBA, gate array, or standard cell, while the reconfigurable structure is a PLA or modified PLA.
摘要:
In accordance with the invention, a method for customizing a one-time configurable integrated circuit to include a multi-time configurable structure is disclosed. Such a method includes, in one embodiment receiving a description of circuit functionality from a user for implementation in the one-time configurable device, where the functionality includes a portion that is designated by the user to be reconfigurable. A method in accordance with an embodiment of the invention then models a reconfigurable structure that has enough capacity to accommodate the designated functionality. Optionally, some embodiments of the invention add in more capacity than is required to implement the designated functionality to allow for future reprogramming. The method then embeds the reconfigurable structure in the one-time configurable device. In certain embodiments, the one-time configurable device can be a mask-programmed MBA, gate array, or standard cell, while the reconfigurable structure is a PLA or modified PLA.
摘要:
A gate array integrated circuit wafer is formed having M−N generic metal interconnection layers and having performance and/or electrical testing circuits which are operative using only the M−N generic metal interconnection layers. Performance and/or electrical tests are performed after generic fabrication is completed, but before the final customization of the wafers. Wafers are sorted and assigned to performance and/or yield bins based upon the results of the performance and/or electrical tests. In another embodiment, all M layers are deposited prior to performance and/or electrical testing; however, the Mth layer is not etched within the active die area prior to performance and/or electrical testing. Subsequent to binning based upon the test results, the final customization is performed by etching the Mth metal layer.
摘要:
A gate array integrated circuit wafer is formed having M-N generic metal interconnection layers and having performance and/or electrical testing circuits which are operative using only the M-N generic metal interconnection layers. The performance and electrical testing circuits are located in the active chip area and/or in the scribe line area between dies on the wafer. Performance and/or electrical tests are performed after generic fabrication is completed, but before the final customization of the wafers. Wafers are sorted and assigned to performance and/or yield bins based upon the results of the performance and/or electrical tests. The contents of different bins are provided to different customers for addition of the final N application specific metal interconnection layers based upon the customer's performance and/or yield requirements. In another embodiment, all M layers are deposited prior to performance and/or electrical testing; however, the Mth layer is not etched within the active die area prior to performance and/or electrical testing. Subsequent to binning based upon the test results, the final customization is performed by etching the Mth metal layer. Further, a programmable gate array integrated circuit which has features for testing and binning for speed and performance grading prior to final personalization or programming on the top layer or layers of interconnecting material is provided.
摘要:
A system and method for automatically analyzing and characterizing Internet search results and annotating a search results page according to specific characteristics of each webpage located at a URL corresponding to a search result. Such characteristics include the composition of each search results webpage as well as which search term elements are present in a webpage located at a URL corresponding to a search result out of those search term elements that were submitted to a search engine to produce the search results webpage. Further, search results are annotated to indicate which search term elements are present in a descendent webpage of a webpage located at a URL corresponding to a search result. Search results may also be optionally filtered according to specific characteristics of a webpage located at a search results URL such that certain categories of webpage are excluded from being referenced in the displayed search results.
摘要:
Systems and methods are disclosed for tracking the progress of a trip where a person or persons wish to have a third party automatically informed of a delayed return. For long duration trips and/or trips to distant destinations, people typically make provision for having their pets and/or children watched over. However for short trips, they typically do not, especially with respect to their pets. The disclosed methods provide monitoring of a trip's progress such that if a traveler doesn't return home by a certain time, a third party is notified, thus avoiding a prolonged period of time wherein the pets and/or children are unattended, especially in the event of a catastrophic accident. The third party may be notified if an arrival time is predicted to be delayed, and when an actual arrival occurs. Provision is also included for adjusting the trip duration to delay or advance a designated arrival time.
摘要:
Systems and methods are described for remote control of a media server computer from a controller device, typically a laptop computer, where remote operation of the media server, including the selection of videos and other digital media may be performed from the controller while normal TV programming (cable, satellite, or broadcast) is viewed on the TV. Other embodiments describe background operations performed on the controller device, the media server, or both, such that new videos may be located on the web or locally on the LAN while a current video is playing on the media server and viewed on the TV. Methods are also described for more reliably establishing network connections between the controller and media server, and systems and methods are described for implementing a multi-video display on the media server where videos to be displayed on the media server are displayed on and selected by a controller device.
摘要:
A binning method is disclosed for measuring semiconductor devices for certain parameters and placing specific devices into different categories or “bins” according to the measured parameters. Measurable parameters include performance/speed-grading, power consumption, current leakage, and the ability to operate at certain temperature extremes. A method for speed grading semi-custom ASIC devices is specifically described that does not require removing partially completed wafers from the fab line for testing. To speed-grade a new boat of partially completed un-customized wafers, a small number of wafers (1 or 2) are processed to completion while being customized specifically for a customer design requiring only the slowest bin. These wafer(s) are then performance tested and the remaining wafers in the boat are certified according to these results for their performance level and placed in a wafer bank for later use.
摘要:
To serve prototype and initial production requirements, an emulation solution is described where an ASIC semiconductor device die containing primarily fixed functions, for example a DSP processor with programmable instruction interface, is mounted in the same package as a conventional FPGA device—the FPGA in this example implementing custom instructions for DSP algorithm acceleration and connecting primarily to the fixed function device. A fully integrated, single die ASIC solution is then available for migration of designs to higher volume production where some of the field programmable function will be replaced with fixed function. The base wafer for the ASIC device used in the prototype package and base wafer for the volume production ASIC device may be the same.