High temperature shape memory polymers
    1.
    发明授权
    High temperature shape memory polymers 有权
    高温形状记忆聚合物

    公开(公告)号:US09447253B2

    公开(公告)日:2016-09-20

    申请号:US14437014

    申请日:2013-11-20

    摘要: A shape memory composition includes a high temperature ionomer having a glass transition temperature or a melting temperature of 100° C. or greater and a modulus at room temperature of 1×108 Pa or greater, the high temperature ionomer including a polymer with ionic units either within the backbone of the polymer or pendant to the backbone or both. The shape memory composition includes crystalline or glassy domains of a low molecular weight non-polymeric compound dispersed in the high temperature ionomer and interacting the ionic units of the high temperature ionomer to form a secondary network characterized by being a reversible network in that it is compromised by the heating of the low molecular weight non-polymeric compound to change out of its crystalline or glassy phase.

    摘要翻译: 形状记忆组合物包括具有玻璃化转变温度或熔融温度为100℃以上的高温离聚物,室温下的模量为1×10 8 Pa以上,高温离聚物包含具有离子单元的聚合物 在聚合物的主链或侧链中的骨架或两者。 形状记忆组合物包括分散在高温离聚物中的低分子量非聚合化合物的结晶或玻璃状结构域,并与高温离子交联聚合物的离子单元相互作用以形成二次网络,其特征在于可逆网络,因为其被破坏 通过加热低分子量非聚合物以改变其结晶或玻璃态。

    HIGH TEMPERATURE SHAPE MEMORY POLYMERS
    2.
    发明申请
    HIGH TEMPERATURE SHAPE MEMORY POLYMERS 有权
    高温形状记忆聚合物

    公开(公告)号:US20150284498A1

    公开(公告)日:2015-10-08

    申请号:US14437014

    申请日:2013-11-20

    IPC分类号: C08G8/32

    摘要: A shape memory composition includes a high temperature ionomer having a glass transition temperature or a melting temperature of 100° C. or greater and a modulus at room temperature of 1×108 Pa or greater, the high temperature ionomer including a polymer with ionic units either within the backbone of the polymer or pendant to the backbone or both. The shape memory composition includes crystalline or glassy domains of a low molecular weight non-polymeric compound dispersed in the high temperature ionomer and interacting the ionic units of the high temperature ionomer to form a secondary network characterized by being a reversible network in that it is compromised by the heating of the low molecular weight non-polymeric compound to change out of its crystalline or glassy phase

    摘要翻译: 形状记忆组合物包括具有玻璃化转变温度或熔融温度为100℃以上的高温离聚物,室温下的模量为1×10 8 Pa以上,高温离聚物包含具有离子单元的聚合物 在聚合物的主链或侧链中的骨架或两者。 形状记忆组合物包括分散在高温离聚物中的低分子量非聚合化合物的结晶或玻璃状结构域,并与高温离子交联聚合物的离子单元相互作用以形成二次网络,其特征在于可逆网络,因为其被破坏 通过加热低分子量非聚合物以改变其结晶或玻璃态