公开(公告)号：US5051154A

公开(公告)日：1991-09-24

申请号：US471381

申请日：1990-01-29

申请人： Roger F. Bernards ,  Gordon Fisher ,  Wade Sonnenberg ,  Edward J. Cerwonka ,  Stewart Fisher

发明人： Roger F. Bernards ,  Gordon Fisher ,  Wade Sonnenberg ,  Edward J. Cerwonka ,  Stewart Fisher

IPC分类号： C25D3/38 ,  C25D7/00 ,  C25D21/12 ,  H05K3/42

CPC分类号： H05K3/42 ,  C25D3/38 ,  H05K3/423 ,  H05K2203/162

摘要： The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.

摘要翻译： 本发明公开了使用酸性镀铜浴的添加剂，其基于产生电镀液的电荷转移超电位的变化的标准来选择; 或者替代地，在高宽比电路板的表面和这种板的凹部之间产生差分超电势。 添加剂可以是单组分或多组分添加剂。

公开(公告)号：US5164069A

公开(公告)日：1992-11-17

申请号：US609442

申请日：1990-11-05

申请人： Edward J. Cerwonka

发明人： Edward J. Cerwonka

IPC分类号： C25D3/16

CPC分类号： C25D3/16

摘要： An aqueous acid electroplating solution comprising nickel ions and one or more acetylenic compounds, specifically mono- and polyglyceryl ethers of acetylenic alcohols; acetylenic compounds useful in the electroplating solution; and processes using such solution and compounds. The invention is particularly useful for nickel plating an irregular surface such as a printed circuit board having through-holes.

摘要翻译： 一种含有镍离子和一种或多种炔属化合物的酸性电镀溶液，特别是炔属醇的单甘油和聚甘油醚; 用于电镀溶液的炔属化合物; 并使用这种溶液和化合物进行处理。 本发明对于诸如具有通孔的印刷电路板的不规则表面的镀镍特别有用。