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公开(公告)号：US5051154A
公开(公告)日：1991-09-24
申请号：US471381
申请日：1990-01-29
CPC分类号： H05K3/42 , C25D3/38 , H05K3/423 , H05K2203/162
摘要： The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.
摘要翻译： 本发明公开了使用酸性镀铜浴的添加剂，其基于产生电镀液的电荷转移超电位的变化的标准来选择; 或者替代地，在高宽比电路板的表面和这种板的凹部之间产生差分超电势。 添加剂可以是单组分或多组分添加剂。
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2.发明授权Electroplating composition and process for plating through holes in printed circuit boards 失效电镀组合物和电镀印刷电路板上的孔的方法
公开(公告)号：US4897165A
公开(公告)日：1990-01-30
申请号：US235051
申请日：1988-08-23
CPC分类号： C25D3/38 , H05K3/42 , H05K3/423 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.Also disclosed is a device for measuring throwing power of a plating solution. The device comprises two anodes and a cathode suspended in a chamber adapted to contain a plating solution. The cathode is suspended between said anodes and comprises two flat electrode portions in electrical contact with each other, in parallel relationship to each other and spaced apart from each other to define a space containing plating solution. Each of said flat electrode portions has electrode portions electrically isolated from a center electrode and means for measuring the current on said first electrode portions and center electrode.
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3.发明授权Method and apparatus for determining throwing power of an electroplating solution 失效用于确定电镀溶液的投射功率的方法和装置
公开(公告)号：US4932518A
公开(公告)日：1990-06-12
申请号：US438021
申请日：1989-11-20
CPC分类号： H05K3/42 , C25D3/38 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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公开(公告)号：US5252196A
公开(公告)日：1993-10-12
申请号：US803281
申请日：1991-12-05
IPC分类号： C25D3/38
CPC分类号： C25D3/38
摘要： Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, including through holes having an aspect ratio equal or greater than about ten to one.
摘要翻译： 电解电镀的组成和工艺。 组合物的特征在于临界量的一种或多种增亮剂和流平剂。 所述组合物特别可用于通过印刷电路板的孔壁进行电镀，包括具有等于或大于约十比一的纵横比的通孔。
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公开(公告)号：US5004525A
公开(公告)日：1991-04-02
申请号：US438020
申请日：1989-11-20
CPC分类号： C25D3/38 , H05K3/42 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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公开(公告)号：US5068013A
公开(公告)日：1991-11-26
申请号：US471639
申请日：1990-01-29
CPC分类号： C25D3/38 , H05K3/42 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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7.发明申请公开(公告)号：US20110039019A1
公开(公告)日：2011-02-17
申请号：US12849609
申请日：2010-08-03
申请人： Roger F. Bernards
发明人： Roger F. Bernards
IPC分类号： H05K3/00
CPC分类号： B23K35/3006 , B23K35/3613 , C23C18/42
摘要： The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.
摘要翻译： 本发明涉及一种用于改善金属表面的可焊性的方法和方法。 在一个实施方案中，本发明是包含酸，银离子源和选自吡咯，三唑和四唑的添加剂的银沉积溶液，以及这些组分的衍生物和混合物。 在另一个实施方案中，银沉积溶液还包括6元杂环化合物，其中6元杂环的3个成员为氮原子。 另一个实施方案是一种用于改善金属表面的可焊性的方法，其涉及如前所述向金属表面施加银沉积溶液。
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8.发明授权Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates 有权用于制备耐化学腐蚀的粗糙铜表面用于粘合到基底的组合物和方法公开(公告)号：US06716281B2
公开(公告)日：2004-04-06
申请号：US10143389
申请日：2002-05-10
IPC分类号： C09K1300
CPC分类号： B32B38/00 , B32B2038/0052 , B32B2311/12 , B32B2457/08 , C23C22/52 , C23F1/18 , H05K3/282 , H05K3/383 , H05K3/385 , H05K3/389 , H05K2201/0239 , H05K2203/0796 , H05K2203/121 , H05K2203/124
摘要： The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.
摘要翻译： 本发明涉及一种用于提供适于随后的多层层压的耐化学腐蚀的粗糙铜表面的方法和组合物。 在一个实施方案中，光滑的铜表面在有效提供粗糙的铜表面的条件下与促粘合组合物接触，该粘合促进组合物包含氧化剂，pH调节剂，形貌改性剂和含硫涂料稳定剂。 在另一个实施方案中，在有效提供粗糙化铜表面的条件下，光滑的铜表面与增粘组合物接触，所述粘合促进组合物包含氧化剂，pH调节剂和形貌改性剂。 然后，在随后的步骤中，将粗糙化的铜表面与耐酸性促进组合物接触。
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9.发明授权公开(公告)号：US08110252B2
公开(公告)日：2012-02-07
申请号：US12849609
申请日：2010-08-03
申请人： Roger F. Bernards
发明人： Roger F. Bernards
IPC分类号： B05D1/18
CPC分类号： B23K35/3006 , B23K35/3613 , C23C18/42
摘要： The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.
摘要翻译： 本发明涉及一种用于改善金属表面的可焊性的方法和方法。 在一个实施方案中，本发明是包含酸，银离子源和选自吡咯，三唑和四唑的添加剂的银沉积溶液，以及这些组分的衍生物和混合物。 在另一个实施方案中，银沉积溶液还包括6元杂环化合物，其中6元杂环的3个成员为氮原子。 另一个实施方案是一种用于改善金属表面的可焊性的方法，其涉及如前所述向金属表面施加银沉积溶液。
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10.发明授权公开(公告)号：US07591956B2
公开(公告)日：2009-09-22
申请号：US11416729
申请日：2006-05-03
IPC分类号： H01B13/00
CPC分类号： C23F1/02 , C23F1/28 , C23F1/44 , H05K3/067 , H05K2203/0361
摘要： A method of stripping nickel from a printed wiring board comprises providing a printed wiring board with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an oxidizer. An aqueous solution comprises ammonium ions, phosphate ions and an oxidizing agent present in amounts effective to strip nickel. An aqueous solution comprises about 1% to about 10% by weight hydrogen peroxide and about 5% to about 30% by weight of an ammonium phosphate. A method of pre-treating a copper substrate comprises providing a printed wiring board having a copper substrate and contacting the copper substrate with phosphate ions, and an oxidizer. A method of neutralizing permanganate on a printed wiring board comprises providing a printed wiring board with a permanganate residue on the printed wiring board and contacting the permanganate residue with phosphate ions, and an oxidizer.
摘要翻译： 从印刷线路板剥离镍的方法包括在表面上提供具有镍沉积物的印刷线路板，并使镍沉积物与磷酸根离子和氧化剂接触。 水溶液包含铵离子，磷酸根离子和以有效剥离镍的量存在的氧化剂。 水溶液包含约1重量％至约10重量％的过氧化氢和约5重量％至约30重量％的磷酸铵。 一种预处理铜基板的方法包括提供具有铜基底并使铜基底与磷酸根离子接触的印刷线路板和氧化剂。 在印刷电路板上中和高锰酸盐的方法包括在印刷线路板上提供印刷线路板上的高锰酸盐残留物，并使高锰酸盐残留物与磷酸根离子接触，以及氧化剂。
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