专利检索 ap:("Rohm AND Haas Electronic Materials CMP Holdings, Inc." OR "Dow Global Technologies LLC") AND inv:"Sarah E. Mastroianni" 第 1 页

1.

发明授权
High planarization efficiency chemical mechanical polishing pads and methods of making 有权

公开(公告)号：US10086494B2

公开(公告)日：2018-10-02

申请号：US15264056

申请日：2016-09-13

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. , Dow Global Technologies LLC

发明人： Jonathan G. Weis , George C. Jacob , Bhawesh Kumar , Sarah E. Mastroianni , Wenjun Xu , Nan-Rong Chiou , Mohammad T. Islam

IPC分类号： B24B37/24 , B24D11/00 , B24B37/22 , B24B53/017

摘要： A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising a curative and a polyisocyanate prepolymer having an unreacted isocyanate (NCO) concentration of from 8.3 to 9.8 wt. % and formed from a polyol blend of polypropylene glycol (PPG) and polytetramethylene ether glycol (PTMEG) and containing a hydrophilic portion of polyethylene glycol or ethylene oxide repeat units, a toluene diisocyanate, and one or more isocyanate extenders, wherein the polyurethane reaction product exhibits a wet Shore D hardness of from 10 to 20% less than the Shore D hardness of the dry polyurethane reaction product.

2.

发明申请
HIGH PLANARIZATION EFFICIENCY CHEMICAL MECHANICAL POLISHING PADS AND METHODS OF MAKING 审中-公开

公开(公告)号：US20180071888A1

公开(公告)日：2018-03-15

申请号：US15264056

申请日：2016-09-13

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. , Dow Global Technologies LLC

发明人： Jonathan G. Weis , George C. Jacob , Bhawesh Kumar , Sarah E. Mastroianni , Wenjun Xu , Nan-Rong Chiou , Mohammad T. Islam

IPC分类号： B24B37/24 , B24B53/017

CPC分类号： B24B37/245 , B24B37/22 , B24B37/24 , B24B53/017 , B24D11/00

摘要： A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising a curative and a polyisocyanate prepolymer having an unreacted isocyanate (NCO) concentration of from 8.3 to 9.8 wt. % and formed from a polyol blend of polypropylene glycol (PPG) and polytetramethylene ether glycol (PTMEG) and containing a hydrophilic portion of polyethylene glycol or ethylene oxide repeat units, a toluene diisocyanate, and one or more isocyanate extenders, wherein the polyurethane reaction product exhibits a wet Shore D hardness of from 10 to 20% less than the Shore D hardness of the dry polyurethane reaction product.