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公开(公告)号：US20160017498A1
公开(公告)日：2016-01-21
申请号：US14332326
申请日：2014-07-15
CPC分类号： C23C18/40 , C23C18/1633 , C23C18/54 , H05K3/00 , H05K3/0094 , H05K3/181 , H05K3/187 , H05K3/422
摘要： Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
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公开(公告)号：US20160122876A1
公开(公告)日：2016-05-05
申请号：US14993791
申请日：2016-01-12
CPC分类号： C23C18/40 , C23C18/1633 , C23C18/54 , H05K3/00 , H05K3/0094 , H05K3/181 , H05K3/187 , H05K3/422
摘要： Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
摘要翻译： 化学镀铜浴包括目前在化学镀工业中使用的常规还原剂的替代还原剂。 无电解铜浴是稳定的，并在基材上沉积鲑鱼明亮的铜沉积物。 许多环保不友好的常规还原剂的排除使得环保的无电镀铜浴液成为可能。
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公开(公告)号：US20140178572A1
公开(公告)日：2014-06-26
申请号：US13769332
申请日：2013-02-17
IPC分类号： C09D1/00
摘要： The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
摘要翻译： 铜无电镀浴是无甲醛的，环保。 无电解铜浴包括一种或多种亚磺酸盐化合物作为还原剂来代替甲醛。 化学镀液是稳定的，并在基材上沉积明亮的铜。
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