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公开(公告)号：US20110197414A1
公开(公告)日：2011-08-18
申请号：US13123964
申请日：2009-10-08
申请人： Roland Burghardt , Bernhard Schmid , Jörg Heimel , Roland Hilser , Dirk Theobald
发明人： Roland Burghardt , Bernhard Schmid , Jörg Heimel , Roland Hilser , Dirk Theobald
CPC分类号： G01C25/00 , G01C21/16 , G01P15/18 , G01P21/00 , Y10T29/49764 , Y10T29/49826
摘要： A method for installing a sensor arrangement into a vehicle having a vehicle chassis, wherein the vehicle chassis is in a defined position during the installation, and the sensor arrangement is attached directly or indirectly to the vehicle chassis, wherein the sensor arrangement includes one or more acceleration sensors with three linearly independent measuring directions, and the sensor arrangement has an electronic control unit which is configured in such a way that it includes a sensor calibration mode, wherein, after the attachment of the sensor arrangement, the at least one acceleration sensor senses the gravitational acceleration, after which the electronic control unit in the sensor calibration mode calculates and stores one or more relative positioning parameters from at least the detected direction of the gravitational acceleration (g), which positioning parameters include at least information about the relative positioning between the sensor arrangement and the vehicle chassis.
摘要翻译： 一种用于将传感器装置安装到具有车辆底盘的车辆中的方法，其中所述车辆底盘在安装期间处于限定位置，并且所述传感器装置直接或间接附接到所述车辆底盘，其中所述传感器装置包括一个或多个 具有三个线性独立测量方向的加速度传感器，并且传感器装置具有电子控制单元，该电子控制单元被构造成使得其包括传感器校准模式，其中，在安装传感器装置之后，至少一个加速度传感器感测 重力加速度之后，传感器校准模式中的电子控制单元从至少所检测的重力加速度方向（g）计算和存储一个或多个相对定位参数，该定位参数至少包括关于 传感器装置和车辆踏板 是的
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2.发明申请SENSOR DEVICE FOR DETECTING AT LEAST ONE ROTATION RATE OF A ROTATING MOTION 有权用于检测旋转运动的一个旋转速率的传感器装置公开(公告)号：US20120017676A1
公开(公告)日：2012-01-26
申请号：US12921630
申请日：2009-03-11
申请人： Bernhard Schmid , Roland Burghardt , Jörg Heimel , Otmar Simon , Roland Hilser
发明人： Bernhard Schmid , Roland Burghardt , Jörg Heimel , Otmar Simon , Roland Hilser
IPC分类号： G01P15/14
CPC分类号： G01C19/56 , G01C19/5755
摘要： In order to be able to perform redundant measurements of rotation rates particularly economically, disclosed herein is a sensor device which includes a dual-axis, first rotation rate sensor element with which rotation rates of rotating motions of the sensor device about a first and a second rotation rate measurement axis can be detected, wherein the first and the second rotation rate measurement axes are oriented orthogonally in relation to one another. The sensor device is defined by the fact that the sensor device includes at least one other rotation rate sensor element with which a rotation rate of a rotating motion of the sensor device about a rotation rate measurement axis, which lies in a plane together with the first and the second rotation rate measurement axes, can be deselected.
摘要翻译： 为了能够特别经济地执行旋转速率的冗余测量，本文公开了一种传感器装置，其包括双轴第一转速传感器元件，传感器装置的旋转运动的旋转速率围绕第一和第二 可以检测转速测量轴，其中第一和第二转速测量轴相对于彼此正交定向。 传感器装置由传感器装置包括至少一个其它旋转速率传感器元件来限定，传感器装置利用旋转速率传感器元件将传感器装置的旋转运动的旋转速度围绕旋转速率测量轴线，该旋转速率测量轴线与第一 和第二转速测量轴，可以取消选择。
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3.发明授权Sensor device for detecting at least one rotation rate of a rotating motion 有权用于检测旋转运动的至少一个旋转速率的传感器装置公开(公告)号：US08695424B2
公开(公告)日：2014-04-15
申请号：US12921630
申请日：2009-03-11
申请人： Bernhard Schmid , Roland Burghardt , Jörg Heimel , Otmar Simon , Roland Hilser
发明人： Bernhard Schmid , Roland Burghardt , Jörg Heimel , Otmar Simon , Roland Hilser
CPC分类号： G01C19/56 , G01C19/5755
摘要： In order to be able to perform redundant measurements of rotation rates particularly economically, disclosed herein is a sensor device which includes a dual-axis, first rotation rate sensor element with which rotation rates of rotating motions of the sensor device about a first and a second rotation rate measurement axis can be detected, wherein the first and the second rotation rate measurement axes are oriented orthogonally in relation to one another. The sensor device is defined by the fact that the sensor device includes at least one other rotation rate sensor element with which a rotation rate of a rotating motion of the sensor device about a rotation rate measurement axis, which lies in a plane together with the first and the second rotation rate measurement axes, can be deselected.
摘要翻译： 为了能够特别经济地执行旋转速率的冗余测量，本文公开了一种传感器装置，其包括双轴第一转速传感器元件，传感器装置的旋转运动的旋转速率围绕第一和第二 可以检测转速测量轴，其中第一和第二转速测量轴相对于彼此正交定向。 传感器装置由传感器装置包括至少一个其它旋转速率传感器元件来限定，传感器装置利用旋转速率传感器元件将传感器装置的旋转运动的旋转速度围绕旋转速率测量轴线，该旋转速率测量轴线与第一 和第二转速测量轴，可以取消选择。
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公开(公告)号：US08752430B2
公开(公告)日：2014-06-17
申请号：US12935645
申请日：2009-04-03
IPC分类号： G01P15/125 , G01P15/18
CPC分类号： G01P15/18 , G01P15/125
摘要： A micromechanical acceleration sensor, including at least one substrate, one or more frames, at least a first frame of which is suspended directly or indirectly on the substrate by at least one spring element, and is deflected with respect to the substrate when at least a first acceleration acts, and at least a first seismic mass which is suspended on the first frame or an additional frame by at least one spring element, and is deflected with respect to this frame when an acceleration acts which is, in particular, different from the first acceleration.
摘要翻译： 一种微机械加速度传感器，包括至少一个基板，一个或多个框架，至少一个框架的至少第一框架通过至少一个弹簧元件直接或间接地悬挂在基板上，并且当至少一个基板 第一加速作用，以及至少第一抗震块，其通过至少一个弹簧元件悬挂在第一框架或附加框架上，并且当加速度作用时相对于该框架偏转，特别是不同于 第一加速。
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公开(公告)号：US20110023606A1
公开(公告)日：2011-02-03
申请号：US12935645
申请日：2009-04-03
IPC分类号： G01P15/125 , H05K3/00
CPC分类号： G01P15/18 , G01P15/125
摘要： A micromechanical acceleration sensor, including at least one substrate, one or more frames, at least a first frame of which is suspended directly or indirectly on the substrate by at least one spring element, and is deflected with respect to the substrate when at least a first acceleration acts, and at least a first seismic mass which is suspended on the first frame or an additional frame by at least one spring element, and is deflected with respect to this frame when an acceleration acts which is, in particular, different from the first acceleration.
摘要翻译： 一种微机械加速度传感器，包括至少一个基板，一个或多个框架，至少一个框架的至少第一框架由至少一个弹簧元件直接地或间接地悬挂在基板上，并且当至少一个基板 第一加速作用，以及至少第一抗震块，其通过至少一个弹簧元件悬挂在第一框架或附加框架上，并且当加速度作用时相对于该框架偏转，特别是不同于 第一加速。
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6.发明申请公开(公告)号：US20120118062A1
公开(公告)日：2012-05-17
申请号：US13266613
申请日：2010-04-28
IPC分类号： G01C19/56
CPC分类号： G01C19/5755 , G01C19/5712
摘要： A method and apparatus for the precise measuring operation of a micromechanical rotation rate sensor, including at least one deflectively suspended seismic mass, at least one drive device for driving the seismic mass, and at least one first and one second trimming electrode element, which are jointly assigned directly or indirectly to the seismic mass, a first electrical trimming voltage (UTO1, UTLO1, UTRO1) being set between the first trimming electrode element and the seismic mass, and a second electrical trimming voltage (UTO2, UTLO2, UTRO2) being set between the second trimming electrode element and the seismic mass, the first and the second electrical trimming voltages being set at least as a function of a quadrature parameter (UT) and a resonance parameter (Uf).
摘要翻译： 一种用于微机电转速传感器的精确测量操作的方法和装置，包括至少一个偏转悬挂的地震质量块，用于驱动地震质量块的至少一个驱动装置，以及至少一个第一和第二修整电极元件， 被联合地直接地或间接地分配给地震质量块，设置在第一修整电极元件和地震块之间的第一修整电压（UTO1，UTLO1，UTRO1）和被设置的第二修整电压（UTO2，UTLO2，UTRO2） 在第二修整电极元件和地震块之间，第一和第二修整电压至少被设置为正交参数（UT）和谐振参数（Uf）的函数。
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7.发明授权Method for the precise measuring operation of a micromechanical rotation rate sensor 有权微机械转速传感器的精确测量操作方法公开(公告)号：US08794047B2
公开(公告)日：2014-08-05
申请号：US13266613
申请日：2010-04-28
IPC分类号： G01C19/56
CPC分类号： G01C19/5755 , G01C19/5712
摘要： A method and apparatus for the precise measuring operation of a micromechanical rotation rate sensor, including at least one deflectively suspended seismic mass, at least one drive device for driving the seismic mass, and at least one first and one second trimming electrode element, which are jointly assigned directly or indirectly to the seismic mass, a first electrical trimming voltage (UTO1, UTLO1, UTRO1) being set between the first trimming electrode element and the seismic mass, and a second electrical trimming voltage (UTO2, UTLO2, UTRO2) being set between the second trimming electrode element and the seismic mass, the first and the second electrical trimming voltages being set at least as a function of a quadrature parameter (UT) and a resonance parameter (Uf).
摘要翻译： 一种用于微机电转速传感器的精确测量操作的方法和装置，包括至少一个偏转悬挂的地震质量块，用于驱动地震质量块的至少一个驱动装置，以及至少一个第一和第二修整电极元件， 被联合地直接地或间接地分配给地震质量块，设置在第一修整电极元件和地震块之间的第一修整电压（UTO1，UTLO1，UTRO1）和被设置的第二修整电压（UTO2，UTLO2，UTRO2） 在第二修整电极元件和地震块之间，第一和第二修整电压至少被设置为正交参数（UT）和谐振参数（Uf）的函数。
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公开(公告)号：US08279615B2
公开(公告)日：2012-10-02
申请号：US12519288
申请日：2007-12-14
申请人： Bernhard Schmid , Roland Hilser , Heikki Kuisma , Altti Torkkeli
发明人： Bernhard Schmid , Roland Hilser , Heikki Kuisma , Altti Torkkeli
IPC分类号： H05K5/00
CPC分类号： H01L23/055 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C1/00301 , H01L2224/73204 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/1433 , H01L2924/1461 , H01L2924/00
摘要： A method for producing an encapsulation module and/or for encapsulating a micromechanical arrangement, wherein electronic connection provisions are formed from a blank of electrically conductive semiconductor material, by one or more structuring processes and/or etching processes, wherein, in the course of forming the electronic connection provisions, a pedestal of the semiconductor material arises, on which the electronic connection provisions are arranged, wherein the latter are subsequently embedded with an embedding material and the embedding material and/or the semiconductor pedestal are removed after the embedding to an extent such that a defined number of the electronic connection provisions have electrical contacts on at least one of the outer surfaces of the encapsulation module thus produced, wherein upon forming the electronic connection provisions, on the pedestal of the semiconductor material, an insular material hump is formed, on which a plated-through hole is arranged in each case, and which embodies a semiconductor electrode.
摘要翻译： 一种用于制造封装模块和/或用于封装微机械装置的方法，其中电子连接装置由导电半导体材料的坯件通过一个或多个结构化工艺和/或蚀刻工艺形成，其中，在成型过程中 电子连接装置出现了半导体材料的基座，其上布置有电子连接装置，其中后者嵌入嵌入材料，并且嵌入材料和/或半导体基座在嵌入之后被移除到一定程度 使得限定数量的电子连接装置在如此制造的封装模块的至少一个外表面上具有电触头，其中在形成电子连接装置时，在半导体材料的基座上形成岛状材料隆起 ，其上布置有电镀通孔， 在每种情况下，并且其包含半导体电极。
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公开(公告)号：US20110113880A1
公开(公告)日：2011-05-19
申请号：US12992401
申请日：2009-05-15
申请人： Bernhard Schmid , Roland Hilser
发明人： Bernhard Schmid , Roland Hilser
IPC分类号： G01P15/02
CPC分类号： G01P15/131 , G01P15/125 , G01P15/18
摘要： A micromechanical acceleration sensor includes at least a first seismic mass which is suspended in a deflectable manner, at least one readout device for detecting the deflection of the first seismic mass and at least one resetting device.
摘要翻译： 微机械加速度传感器至少包括以可偏转的方式悬挂的第一地震质量块，用于检测第一地震质量块和至少一个复位装置的挠曲的至少一个读出装置。
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公开(公告)号：US20100290199A1
公开(公告)日：2010-11-18
申请号：US12519288
申请日：2007-12-14
申请人： Bernhard Schmid , Roland Hilser , Heikki Kuisma , Altti Torkkeli
发明人： Bernhard Schmid , Roland Hilser , Heikki Kuisma , Altti Torkkeli
CPC分类号： H01L23/055 , B81B2207/012 , B81B2207/095 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C1/00301 , H01L2224/73204 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/1433 , H01L2924/1461 , H01L2924/00
摘要： A method for producing an encapsulation module and/or for encapsulating a micromechanical arrangement, wherein electronic connection provisions are formed from a blank of electrically conductive semiconductor material, by one or more structuring processes and/or etching processes, wherein, in the course of forming the electronic connection provisions, a pedestal of the semiconductor material arises, on which the electronic connection provisions are arranged, wherein the latter are subsequently embedded with an embedding material and the embedding material and/or the semiconductor pedestal are removed after the embedding to an extent such that a defined number of the electronic connection provisions have electrical contacts on at least one of the outer surfaces of the encapsulation module thus produced, whereinupon forming the electronic connection provisions, on the pedestal of the semiconductor material, an insular material hump is formed, on which a plated-through hole is arranged in each case, and which embodies a semiconductor electrode.
摘要翻译： 一种用于制造封装模块和/或用于封装微机械装置的方法，其中电子连接装置由导电半导体材料的坯件通过一个或多个结构化工艺和/或蚀刻工艺形成，其中，在成型过程中 电子连接装置出现了半导体材料的基座，其上布置有电子连接装置，其中后者嵌入嵌入材料，并且嵌入材料和/或半导体基座在嵌入之后被移除到一定程度 使得限定数量的电子连接装置在如此制造的封装模块的至少一个外表面上具有电触头，其中在形成电子连接装置时，在半导体材料的基座上形成岛状材料隆起 ，其上布置有电镀通孔， 在每种情况下，并且其包含半导体电极。
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