DESICCANT COMPOSITION FOR MOISTURE-SENSITIVE ELECTRONIC DEVICES
    2.
    发明申请
    DESICCANT COMPOSITION FOR MOISTURE-SENSITIVE ELECTRONIC DEVICES 有权
    用于湿敏感电子器件的防腐剂组合物

    公开(公告)号:US20140070140A1

    公开(公告)日:2014-03-13

    申请号:US13980306

    申请日:2013-03-15

    IPC分类号: B01D53/28

    CPC分类号: B01D53/28 C08K3/22 C08K3/34

    摘要: A desiccant composition containing a polymeric binder and a dispersion of powders of desiccant materials is described. The desiccant composition has desiccant powders that are dispersed at least in part in form of micro-aggregates of desiccant particles surrounded by a polymeric encapsulating material having a different composition with respect to the polymeric binder.

    摘要翻译: 描述了含有聚合物粘合剂和干燥剂材料粉末分散体的干燥剂组合物。 干燥剂组合物具有干燥剂粉末,其至少部分地分散在由相对于聚合物粘合剂具有不同组成的聚合物包封材料包围的干燥剂颗粒的微团聚体的形式中。

    Curable polymeric compositions having improved oxygen barrier properties

    公开(公告)号:US11242477B1

    公开(公告)日:2022-02-08

    申请号:US17293567

    申请日:2021-03-10

    IPC分类号: C09J163/10 C09J11/08

    摘要: Curable polymeric compositions with improved barrier property to oxygen suitable to be used on flexible substrates containing a bisphenol F epoxy resin, at least an epoxy acrylate component and at least a rubber modified bisphenol and further comprising EVOH capsules or beads dispersed therein. The polymeric compositions are applicable either by a melt or liquid coating technique and undergo curing upon exposure to heat, showing viscoelastic properties and suitable to provide a cured product having high durability.

    Desiccant composition for moisture-sensitive electronic devices
    6.
    发明授权
    Desiccant composition for moisture-sensitive electronic devices 有权
    湿度敏感电子设备的干燥剂组合物

    公开(公告)号:US08741175B2

    公开(公告)日:2014-06-03

    申请号:US13980306

    申请日:2013-03-15

    IPC分类号: C09K3/00 B01D53/28

    CPC分类号: B01D53/28 C08K3/22 C08K3/34

    摘要: A desiccant composition containing a polymeric binder and a dispersion of powders of desiccant materials is described. The desiccant composition has desiccant powders that are dispersed at least in part in form of micro-aggregates of desiccant particles surrounded by a polymeric encapsulating material having a different composition with respect to the polymeric binder.

    摘要翻译: 描述了含有聚合物粘合剂和干燥剂材料粉末分散体的干燥剂组合物。 干燥剂组合物具有干燥剂粉末,其至少部分地分散在由相对于聚合物粘合剂具有不同组成的聚合物包封材料包围的干燥剂颗粒的微团聚体的形式中。