DESICCANT COMPOSITION FOR MOISTURE-SENSITIVE ELECTRONIC DEVICES
    1.
    发明申请
    DESICCANT COMPOSITION FOR MOISTURE-SENSITIVE ELECTRONIC DEVICES 有权
    用于湿敏感电子器件的防腐剂组合物

    公开(公告)号:US20140070140A1

    公开(公告)日:2014-03-13

    申请号:US13980306

    申请日:2013-03-15

    IPC分类号: B01D53/28

    CPC分类号: B01D53/28 C08K3/22 C08K3/34

    摘要: A desiccant composition containing a polymeric binder and a dispersion of powders of desiccant materials is described. The desiccant composition has desiccant powders that are dispersed at least in part in form of micro-aggregates of desiccant particles surrounded by a polymeric encapsulating material having a different composition with respect to the polymeric binder.

    摘要翻译: 描述了含有聚合物粘合剂和干燥剂材料粉末分散体的干燥剂组合物。 干燥剂组合物具有干燥剂粉末,其至少部分地分散在由相对于聚合物粘合剂具有不同组成的聚合物包封材料包围的干燥剂颗粒的微团聚体的形式中。

    Desiccant composition for moisture-sensitive electronic devices
    4.
    发明授权
    Desiccant composition for moisture-sensitive electronic devices 有权
    湿度敏感电子设备的干燥剂组合物

    公开(公告)号:US08741175B2

    公开(公告)日:2014-06-03

    申请号:US13980306

    申请日:2013-03-15

    IPC分类号: C09K3/00 B01D53/28

    CPC分类号: B01D53/28 C08K3/22 C08K3/34

    摘要: A desiccant composition containing a polymeric binder and a dispersion of powders of desiccant materials is described. The desiccant composition has desiccant powders that are dispersed at least in part in form of micro-aggregates of desiccant particles surrounded by a polymeric encapsulating material having a different composition with respect to the polymeric binder.

    摘要翻译: 描述了含有聚合物粘合剂和干燥剂材料粉末分散体的干燥剂组合物。 干燥剂组合物具有干燥剂粉末,其至少部分地分散在由相对于聚合物粘合剂具有不同组成的聚合物包封材料包围的干燥剂颗粒的微团聚体的形式中。