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公开(公告)号:US20200336078A1
公开(公告)日:2020-10-22
申请号:US16765412
申请日:2018-11-16
摘要: An electrical power module comprising power components and supports, each including at least one metal portion, the metal portions of the supports forming a substrate of the electrical power module, at least one support comprising two angled metal portions that are angled relative to each other at an angle that is greater than 0°, each power component being fastened to two metal portions of two distinct supports by being positioned between said two metal portions, the electrical power module being arranged in such a manner that electrical power currents going to or coming from the power components flow in the metal portions of the supports.
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公开(公告)号:US20230058192A1
公开(公告)日:2023-02-23
申请号:US17911348
申请日:2021-02-19
IPC分类号: H01L23/367 , H01L23/467 , H01L23/373 , F28F3/02 , F28F1/16 , F28F13/08
摘要: The invention relates to a device (2) for transferring heat from a thermally conductive plate (3) capable of capturing the heat from a zone placed on a first side (32) of the plate, the device comprising at least one fin (35) placed on a second side (34) of the plate (30) opposite the first side (32) and having a duct (36) extending in a longitudinal direction (L) between a first end (38) connected to the plate and a second end (4) opposite the first end and which opens out, the duct (36) being connected to at least one Venturi-effect neck (42) bringing cooling air into the duct, the neck (42) being formed in the vicinity of the first end of the duct and the plate (30).
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公开(公告)号:US20180292281A1
公开(公告)日:2018-10-11
申请号:US15578676
申请日:2016-06-03
发明人: Eric BAILLY , Jean-Christophe RIOU
摘要: A pressure measurement device comprising a pressure sensor of a first type and a pressure sensor of a second type different from the first, which sensors are mounted on a common support in order to be subjected to the same pressure, in which the pressure sensor of the first type is of the capacitive type, the device being characterized in that the pressure sensor of the first type comprises at least one membrane and a first internal channel passing through the common support, a second internal channel bringing a fluid to the membrane being in fluid flow connection with the first internal channel. A calibration method associated with the device.
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公开(公告)号:US20180172539A1
公开(公告)日:2018-06-21
申请号:US15735400
申请日:2016-06-07
发明人: Jean-Christophe RIOU , Eric BAILLY
CPC分类号: G01L19/146 , G01L7/082 , G01L19/0681 , G01L19/147
摘要: A pressure detection device including a mount whereon a pressure sensor is attached which comprises a membrane which has a surface intended to be subjected to a pressurized fluid and which is so arranged as to elastically deform according to pressure, and means for determining the deformation of the membrane along an axis normal to a mid-plane of the membrane in the rest state. The membrane is supported by a frame connected to the mount by a mechanical decoupling structure in order to isolate the membrane from stress resulting from a differential thermal expansion between the frame and the mount, with the membrane and the frame being made of the same material.
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公开(公告)号:US20240170450A1
公开(公告)日:2024-05-23
申请号:US18283972
申请日:2022-03-28
IPC分类号: H01L23/00 , H01L25/065
CPC分类号: H01L24/83 , H01L24/29 , H01L24/32 , H01L24/75 , H01L25/0655 , H01L2224/29139 , H01L2224/33181 , H01L2224/75272 , H01L2224/7555 , H01L2224/7592 , H01L2224/83093 , H01L2224/83097 , H01L2224/83203 , H01L2224/83908
摘要: The method comprises the following successive steps: — depositing sintering material (26) onto one of an electronic component (28) and a substrate (30); — heating the material (26) so as to bring a temperature of the material to a preliminary exothermic peak, which precedes an exothermic sintering peak, without the temperature of the material reaching a maximum of the preliminary exothermic peak; — fastening the other of the component (28) and the substrate (30) to the material (26) so that the material is interposed between the component and the substrate; and— pressing the material (26) while hot so as to cause it to creep.
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公开(公告)号:US20200064217A1
公开(公告)日:2020-02-27
申请号:US16673181
申请日:2019-11-04
发明人: Eric BAILLY , Jean-Christophe RIOU
摘要: A pressure measurement device comprising a pressure sensor of a first type and a pressure sensor of a second type different from the first, which sensors are mounted on a common support in order to be subjected to the same pressure, in which the pressure sensor of the first type is of the capacitive type, the device being characterized in that the pressure sensor of the first type comprises at least one membrane and a first internal channel passing through the common support, a second internal channel bringing a fluid to the membrane being in fluid flow connection with the first internal channel. A calibration method associated with the device.
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公开(公告)号:US20190047044A1
公开(公告)日:2019-02-14
申请号:US15760056
申请日:2016-09-15
CPC分类号: B22F1/0059 , B22F7/064 , H01G9/0029 , H01G9/15 , H05K1/097 , H05K3/32 , H05K3/3442 , H05K3/3494 , H05K2203/1131
摘要: An assembly method for assembling a first element to a second element by pressureless metal sintering, the method having a preparation step during which a sintering material is arranged at a bond interface of the elements, a pre-sintering step during which the assembly is heated for a first duration that is longer than five minutes at a first temperature that is higher than 200° C. and strictly lower than or equal to the temperature for activating diffusion at the grain boundaries, and a densification step during which the assembly is heated for a second duration at a second temperature that is higher than or equal to the temperature for activating diffusion at the grain boundaries.
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公开(公告)号:US20220406694A1
公开(公告)日:2022-12-22
申请号:US17755982
申请日:2020-11-12
发明人: Toni YOUSSEF , Stéphane Joseph AZZOPARDI , Thanh Long LE , Jean-Christophe RIOU , Nawres SRIDI-CONVERS
IPC分类号: H01L23/495 , H01L21/48 , H01L21/56
摘要: A conductive metal frame for a power electronics module comprising at least first and second power semiconductor components each having upper and lower faces, connectors for linking these power semiconductor components to external electrical circuits and at least one radiator for expelling via the conductive metal frame the heat flow generated by the power semiconductor components, the conductive metal frame being characterized in that the connectors, the at least one radiator and the conductive metal frame forming a single three-dimensional part made of a single material on an inner surface of which the first and second power semiconductor components are intended to be attached by their lower faces and provision is made for a central folding line so that, once the conductive metal frame is folded on itself, enclosing the first and second power semiconductor components, it provides a double-sided cooling assembly.
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公开(公告)号:US20210348977A1
公开(公告)日:2021-11-11
申请号:US17271884
申请日:2019-08-27
申请人: SAFRAN ELECTRONICS & DEFENSE , Compagnie Generale Des Etablissements Michelin , Safran Landing Systems , Safran
发明人: Jean-Christophe RIOU , Eric BAILLY
摘要: A pressure measurement device (1) comprising a housing (20) extending around an electronic card (30) provided with a pressure sensor (40); the housing (20) co-operating with a first face (31) of the electronic card (30) to define a first sealed volume (3); the housing (20) also co-operating with a second face (32) of the electronic card (30) that is opposite from the first face (31) to define a second sealed volume (4); the housing (20) including at least one first channel (24) putting the medium (5) outside the housing (20) into fluid flow communication with the first sealed volume (3); the electronic card (30) including at least one second channel (33) putting the first volume (3) into fluid flow communication with the second volume (4); and the connection between the housing (20) and the electronic card (30) being arranged to allow relative movement between the housing (20) and the electronic card.
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公开(公告)号:US20210309511A1
公开(公告)日:2021-10-07
申请号:US17279787
申请日:2019-10-09
摘要: A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.
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