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公开(公告)号:US10947154B2
公开(公告)日:2021-03-16
申请号:US16473893
申请日:2017-12-22
Applicant: SAINT-GOBAIN GLASS FRANCE
Inventor: Camille Morin , Arnaud Huignard , Mathieu Urien
Abstract: A heating device equipped with a chamber defining a cavity, includes a door or wall incorporating a multiple glazing, the glazing including at least one transparent substrate coated on each face with a stack of thin layers, namely: on a first face, turned toward the cavity, a first stack that reflects heat essentially by virtue of one or more functional layers based on indium tin oxide; and on the other face, turned toward the exterior of the device, a second stack that reflects heat essentially by virtue of one or more functional layers based on a metal chosen from gold or silver.
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公开(公告)号:US20140338741A1
公开(公告)日:2014-11-20
申请号:US14357470
申请日:2012-11-09
Applicant: SAINT-GOBAIN GLASS FRANCE
Inventor: Joerg Palm , Mathieu Urien , Gerard Ruitenberg , Charles Leyder , Andreas Heiss , Erwan Mahe , Delphine Dupuy
IPC: H01L31/0224 , H01L31/18 , H01L31/0216 , H01L31/0296
CPC classification number: H01L31/022425 , H01L31/02167 , H01L31/0296 , H01L31/0322 , H01L31/03923 , H01L31/18 , H01L31/1828 , H01L31/1864 , Y02E10/541 , Y02P70/521
Abstract: A subject-matter of the invention is a conducting substrate (1) for a photovoltaic cell, comprising a carrier substrate (2) and an electrode coating (6) formed on the carrier substrate (2). The electrode coating (6) comprises a main molybdenum-based layer (8) formed on the carrier substrate (2), a barrier layer to selenization (10) formed on the main molybdenum-based layer (8) and, on the barrier layer to selenization (10), an upper layer (12) based on a metal M capable of forming, after sulfurization and/or selenization, an ohmic contact layer with a photoactive semiconducting material. The barrier layer to selenization (10) has a thickness of less than or equal to 50 nm, preferably of less than or equal to 30 nm, more preferably of less than or equal to 20 nm.
Abstract translation: 本发明的主题是用于光伏电池的导电基板(1),其包括载体基板(2)和形成在载体基板(2)上的电极涂层。 电极涂层(6)包括形成在载体基板(2)上的主钼基层(8),形成在主钼基层(8)上的阻挡层(硒化)(10),并且在阻挡层 基于能够在硫化和/或硒化后形成具有光敏半导体材料的欧姆接触层的金属M的上层(12)。 硒化(10)的阻挡层具有小于或等于50nm,优选小于或等于30nm,更优选小于或等于20nm的厚度。
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