THIN FILM ENCAPSULATION MANUFACTURING DEVICE AND METHOD OF MANUFACTURING THIN FILM ENCAPSULATION
    2.
    发明申请
    THIN FILM ENCAPSULATION MANUFACTURING DEVICE AND METHOD OF MANUFACTURING THIN FILM ENCAPSULATION 审中-公开
    薄膜封装制造装置及制造薄膜封装的方法

    公开(公告)号:US20160208381A1

    公开(公告)日:2016-07-21

    申请号:US14800652

    申请日:2015-07-15

    Abstract: A thin film encapsulation manufacturing device and a method of manufacturing a thin film encapsulation unit are provided. The thin film encapsulation manufacturing device includes: a first buffer unit configured to load a first substrate and a second substrate; a first cluster connected to the first buffer unit and including a first deposition chamber; and a second cluster connected to the first cluster and including a second deposition chamber, wherein the first substrate and the second substrate are alternately input to the first cluster from the first buffer unit, and a first deposition material is deposited on the first substrate in the first deposition chamber, and the first deposition material is deposited on the second substrate in the second deposition chamber.

    Abstract translation: 提供薄膜封装制造装置和制造薄膜封装单元的方法。 薄膜封装制造装置包括:第一缓冲单元,被配置为加载第一基板和第二基板; 连接到第一缓冲单元并包括第一沉积室的第一簇; 以及连接到所述第一簇并且包括第二沉积室的第二簇,其中所述第一基板和所述第二基板从所述第一缓冲单元交替地输入到所述第一簇,并且第一沉积材料沉积在所述第一基板上 第一沉积室,并且第一沉积材料沉积在第二沉积室中的第二基板上。

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