公开(公告)号：US09953600B2

公开(公告)日：2018-04-24

申请号：US15141912

申请日：2016-04-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Se-Hui Jang ,  Chong-Guk Lee ,  Sang-Moon Moh ,  Su-Mi Moon

IPC: G06F3/038 ,  G09G3/36 ,  G02F1/1333

CPC classification number: G09G3/3648 ,  G02F1/1333 ,  G02F1/13452 ,  G09G2300/0426 ,  G09G2300/08

Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

公开(公告)号：US10031385B2

公开(公告)日：2018-07-24

申请号：US15604877

申请日：2017-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H01L23/48 ,  G02F1/1345 ,  H01L27/12 ,  H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H01L23/00

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US09664964B2

公开(公告)日：2017-05-30

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H01L23/48 ,  G02F1/1345 ,  H01L27/12 ,  H01L23/498 ,  H05K1/02 ,  H01L23/00 ,  H05K1/18

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US20160062172A1

公开(公告)日：2016-03-03

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/00 ,  H01L27/12

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract translation: 薄膜封装芯片包括基底基板，输入线，集成电路（IC）芯片和输出线。 输入线设置在基底基板上.IC芯片电连接到输入线。 输出线包括主输出和副输出线。主输出线与IC芯片电连接，并从IC芯片沿第一方向延伸。 副输出线电连接到IC芯片。 子输出线包括至少六个弯曲部分，并且沿第一方向延伸。