公开(公告)号：US20180329253A1

公开(公告)日：2018-11-15

申请号：US16042401

申请日：2018-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/498 ,  H05K1/02 ,  H01L27/12 ,  H05K1/18 ,  H01L23/00

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US09664964B2

公开(公告)日：2017-05-30

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H01L23/48 ,  G02F1/1345 ,  H01L27/12 ,  H01L23/498 ,  H05K1/02 ,  H01L23/00 ,  H05K1/18

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US20160062172A1

公开(公告)日：2016-03-03

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/00 ,  H01L27/12

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract translation: 薄膜封装芯片包括基底基板，输入线，集成电路（IC）芯片和输出线。 输入线设置在基底基板上.IC芯片电连接到输入线。 输出线包括主输出和副输出线。主输出线与IC芯片电连接，并从IC芯片沿第一方向延伸。 副输出线电连接到IC芯片。 子输出线包括至少六个弯曲部分，并且沿第一方向延伸。

公开(公告)号：US11215883B2

公开(公告)日：2022-01-04

申请号：US16924618

申请日：2020-07-09

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H05K1/02 ,  G02F1/1345 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H05K1/18

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US10031385B2

公开(公告)日：2018-07-24

申请号：US15604877

申请日：2017-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H01L23/48 ,  G02F1/1345 ,  H01L27/12 ,  H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H01L23/00

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US10747074B2

公开(公告)日：2020-08-18

申请号：US16042401

申请日：2018-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H05K1/02 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H05K1/18

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US10108032B2

公开(公告)日：2018-10-23

申请号：US15181884

申请日：2016-06-14

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Su-Mi Moon ,  Seonmi Kim ,  Chongguk Lee ,  Sehui Jang ,  Sangmoon Moh

IPC: G02F1/1345 ,  G02F1/133 ,  G02F1/1333 ,  G02F1/1368 ,  H01L27/12 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56 ,  H04N5/44

Abstract: A curved display apparatus includes a curved display panel, a driver, a controller and a plurality of flexible substrates. The curved display panel extends in a tangential direction with respect to a first axis direction. The driver applies a driving signal to the curved display panel. The controller includes a curved printed circuit board extending in the tangential direction with respect to a first axis direction. The controller applies a control signal to the driver. The flexible substrates electrically connect the curved printed circuit board with the curved display panel. Each of the flexible substrates includes a first connection portion connected to the curved display panel, a second connection portion connected to the curved printed circuit board and a flexible substrate body connecting the first connection portion with the second connection portion. The flexible substrate body extends in a radial direction with respect to the first axis direction.

公开(公告)号：US09953600B2

公开(公告)日：2018-04-24

申请号：US15141912

申请日：2016-04-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Se-Hui Jang ,  Chong-Guk Lee ,  Sang-Moon Moh ,  Su-Mi Moon

IPC: G06F3/038 ,  G09G3/36 ,  G02F1/1333

CPC classification number: G09G3/3648 ,  G02F1/1333 ,  G02F1/13452 ,  G09G2300/0426 ,  G09G2300/08

Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

公开(公告)号：US20170069253A1

公开(公告)日：2017-03-09

申请号：US15141912

申请日：2016-04-29

Applicant: SAMSUNG DISPLAY CO. LTD.

Inventor： SE-HUI JANG ,  Chong-Guk Lee ,  Sang-Moon Moh ,  Su-Mi Moon

IPC: G09G3/20

CPC classification number: G09G3/3648 ,  G02F1/1333 ,  G02F1/13452 ,  G09G2300/0426 ,  G09G2300/08

Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

Abstract translation: 显示装置包括第一基板和第二基板。 第一基板包括与开关元件电连接的开关元件和像素电极。 显示面板驱动器将驱动信号施加到显示面板。 显示面板驱动器包括印刷电路板，其包括将印刷电路板与显示面板电连接的第一接合焊盘和柔性基板。 柔性基板包括第二接合焊盘。 第二接合焊盘电连接到印刷电路板的第一接合焊盘。 第一接合焊盘与第二接合焊盘重叠。 第一接合焊盘的至少一部分和第二接合焊盘的至少一部分相对于与显示面板的相对较长的一侧平行的第一方向成锐角的方向延伸。