公开(公告)号：US11215883B2

公开(公告)日：2022-01-04

申请号：US16924618

申请日：2020-07-09

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H05K1/02 ,  G02F1/1345 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H05K1/18

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US20180329253A1

公开(公告)日：2018-11-15

申请号：US16042401

申请日：2018-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/498 ,  H05K1/02 ,  H01L27/12 ,  H05K1/18 ,  H01L23/00

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US10747074B2

公开(公告)日：2020-08-18

申请号：US16042401

申请日：2018-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H05K1/02 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H05K1/18

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.