公开(公告)号：US20240164013A1

公开(公告)日：2024-05-16

申请号：US18221001

申请日：2023-07-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Heun LEE ,  Jong Eun PARK ,  Chan Jin PARK ,  Hyun Seok YANG ,  Tae Hee YOO

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/26

CPC classification number: H05K1/0298 ,  H05K3/181 ,  H05K3/26

Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering a portion of a side surface of each of the plurality of first circuit patterns; and an insulator disposed between at least one pair of adjacent first circuit patterns, among the plurality of first circuit patterns, and integrated with the first insulating layer, and a method for manufacturing a printed circuit board, are provided.

公开(公告)号：US20240215158A1

公开(公告)日：2024-06-27

申请号：US18209616

申请日：2023-06-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Jeong JEON ,  Hyun Seok YANG ,  Tae Hee YOO ,  Chan Jin PARK

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/0306 ,  H05K3/0017 ,  H05K3/4038 ,  H05K2201/0338 ,  H05K2203/0186 ,  H05K2203/0315 ,  H05K2203/0582 ,  H05K2203/072 ,  H05K2203/0723

Abstract: A printed circuit board includes a first insulating layer, a first metal layer disposed on the first insulating layer and including a first oxidation region on a side surface thereof, and a second metal layer disposed on the first metal layer. A method of manufacturing a printed circuit board includes forming a first metal layer on a first insulating layer, forming a second metal layer on a portion of the first metal layer, oxidizing another portion of the first metal layer to form a first oxidation region, and removing at least a portion of the first oxidation region.