公开(公告)号：US20150223341A1

公开(公告)日：2015-08-06

申请号：US14597795

申请日：2015-01-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Hoon KIM ,  Tae Hong MIN ,  Young Gwan KO ,  Hye Jin KIM ,  Suk Hyeon CHO ,  Chil Woo KWON ,  Jung Han LEE

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/00 ,  H05K3/02 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K3/007 ,  H01L21/568 ,  H01L2224/04105 ,  H05K1/113 ,  H05K1/185 ,  H05K3/4623 ,  H05K3/4682 ,  H05K3/4697 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: An embedded board, a printed circuit board, and a method of manufacturing the same. According to one embodiment of the present invention, an embedded board includes: a core insulating layer formed with a first cavity; a first circuit layer formed on one surface of the core insulating layer; a build-up insulating layer formed on one surface of the core insulating layer and formed with a second cavity extending from the first cavity; devices disposed in the first cavity and the second cavity and formed to protrude from one surface of the core insulating layer; a first insulating layer formed on the other surface of the core insulating layer and filling the first cavity and the second cavity; and a build-up circuit layer and a via formed in the build-up insulating layer.

Abstract translation: 嵌入式电路板，印刷电路板及其制造方法。 根据本发明的一个实施例，嵌入式板包括：形成有第一腔的芯绝缘层; 形成在所述芯绝缘层的一个表面上的第一电路层; 形成在所述芯绝缘层的一个表面上且形成有从所述第一腔延伸的第二腔的积聚绝缘层; 设置在所述第一腔和所述第二腔中并且形成为从所述芯绝缘层的一个表面突出的器件; 形成在所述芯绝缘层的另一个表面上并填充所述第一腔和所述第二腔的第一绝缘层; 以及在积层绝缘层中形成的积聚电路层和通孔。