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公开(公告)号：US20160309575A1
公开(公告)日：2016-10-20
申请号：US15198110
申请日：2016-06-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Myung Sam KANG , Jung Han LEE , Young Gwan KO
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/2518 , H01L2924/15311 , H01L2924/3511 , H05K1/0204 , H05K1/0207 , H05K1/0209 , H05K1/0298 , H05K1/111 , H05K1/181 , H05K1/185 , H05K3/4602 , H05K3/4608 , H05K2201/0195 , H05K2201/0323 , H05K2201/0338 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10416 , H05K2201/10674 , H05K2201/10727
Abstract: A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.
Abstract translation: 电路板包括绝缘部分，其包括绝缘层，设置在绝缘层上的金属层，每个穿过绝缘层中的至少一个绝缘层的通孔，并将金属层中的至少两个金属层连接在一起; 包括导热材料的第一导热结构，所述导热结构的至少一部分插入到所述绝缘部分中，具有与所述第一导热结构接触的一个表面的第一通孔，第一金属图案与所述第一导热结构的第一 通孔，连接到第一金属图案的第一接合构件以及在布置在绝缘部分的最外表面上的金属层的最外表面上连接有第一电子部件的焊盘，所述焊盘至少在第一区域中 以及具有比第一区域更高的温度的第二区域。
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Patent Agency Ranking
公开(公告)号：US20160095202A1
公开(公告)日：2016-03-31
申请号：US14870192
申请日：2015-09-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae Hong MIN , Young Gwan KO , Jung Han LEE , Myung Sam KANG
CPC classification number: H05K3/445 , H01L24/13 , H01L24/16 , H01L24/48 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2224/48227 , H01L2224/81444 , H01L2924/00014 , H05K1/0271 , H05K3/429 , H05K3/4608 , H05K2201/09581 , H05K2203/0392 , H01L2924/014 , H01L2224/45099
Abstract: A circuit board includes a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof; a plated part provided to a surface of the first via hole; an insulating film provided to a surface of the plated part; and a first via formed by providing a conductive material to at least a portion of a region surrounded by an outer surface of the insulating film. Since the circuit board may implement fineness of the first via while forming the first metal layer to be thicker than the related art, warpage may be decreased and heat dissipation performance may be improved.
Abstract translation: 电路板包括具有穿过第一金属层的上表面的第一通孔及其下表面的第一金属层; 设置在所述第一通孔的表面上的电镀部; 设置在电镀部的表面的绝缘膜; 以及通过向由绝缘膜的外表面包围的区域的至少一部分提供导电材料而形成的第一通孔。 由于电路板可以实现第一通孔的细度，同时形成第一金属层比现有技术更厚，因此翘曲可能降低，并且可以提高散热性能。
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3.发明申请公开(公告)号：US20150223341A1
公开(公告)日：2015-08-06
申请号：US14597795
申请日：2015-01-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Hoon KIM , Tae Hong MIN , Young Gwan KO , Hye Jin KIM , Suk Hyeon CHO , Chil Woo KWON , Jung Han LEE
CPC classification number: H05K3/007 , H01L21/568 , H01L2224/04105 , H05K1/113 , H05K1/185 , H05K3/4623 , H05K3/4682 , H05K3/4697 , Y10T29/49128 , Y10T29/4913
Abstract: An embedded board, a printed circuit board, and a method of manufacturing the same. According to one embodiment of the present invention, an embedded board includes: a core insulating layer formed with a first cavity; a first circuit layer formed on one surface of the core insulating layer; a build-up insulating layer formed on one surface of the core insulating layer and formed with a second cavity extending from the first cavity; devices disposed in the first cavity and the second cavity and formed to protrude from one surface of the core insulating layer; a first insulating layer formed on the other surface of the core insulating layer and filling the first cavity and the second cavity; and a build-up circuit layer and a via formed in the build-up insulating layer.
Abstract translation: 嵌入式电路板，印刷电路板及其制造方法。 根据本发明的一个实施例，嵌入式板包括：形成有第一腔的芯绝缘层; 形成在所述芯绝缘层的一个表面上的第一电路层; 形成在所述芯绝缘层的一个表面上且形成有从所述第一腔延伸的第二腔的积聚绝缘层; 设置在所述第一腔和所述第二腔中并且形成为从所述芯绝缘层的一个表面突出的器件; 形成在所述芯绝缘层的另一个表面上并填充所述第一腔和所述第二腔的第一绝缘层; 以及在积层绝缘层中形成的积聚电路层和通孔。
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公开(公告)号：US20160037620A1
公开(公告)日：2016-02-04
申请号：US14668804
申请日：2015-03-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam KANG , Young Gwan KO , Tae Hong MIN , Jung Han LEE
CPC classification number: H05K1/0204 , H01L23/3677 , H01L23/49827 , H05K1/0206 , H05K3/4602 , H05K2201/10416
Abstract: There is provided a printed circuit board including: a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and a lower surface of the core layer; and a heat dissipating via penetrating through the insulating layer to be in contact with the heat radiation body and dissipating heat externally, wherein the heat radiation body includes an insulating plate, a first metal block formed on an upper surface of the insulating plate, and a second metal block formed on a lower surface of the insulating plate.
Abstract translation: 提供了一种印刷电路板，包括：其中形成有腔的芯层; 包括在腔中的散热体; 设置在所述芯层的上表面和下表面上的绝缘层; 以及通过贯穿所述绝缘层与所述散热体接触并从外部散热的散热部，其中所述散热体包括绝缘板，形成在所述绝缘板的上表面上的第一金属块，以及 第二金属块形成在绝缘板的下表面上。
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公开(公告)号：US20150021074A1
公开(公告)日：2015-01-22
申请号：US14298098
申请日：2014-06-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Hoon KIM , Tae Hong MIN , Jung Han LEE , Hye Jin KIM
CPC classification number: H05K1/0271 , H01L2924/3511 , H05K1/111 , H05K1/115 , H05K1/185 , H05K3/0097 , H05K3/429 , H05K3/4602 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0352 , H05K2201/09136 , H05K2203/0191 , H05K2203/1536 , Y10T29/49139
Abstract: Disclosed herein is a printed circuit board capable of implementing slimness by decreasing the number of entire layers through an asymmetrical build-up structure in which an electric device is embedded, the printed circuit board including: a core layer including a cavity formed therein so that an electric device is embedded and a circuit pattern and a pad formed on upper and lower surfaces thereof; a through via formed in the core layer so as to connect the upper and the lower pads of the core layer to each other; a plurality of insulating layers built-up on the core layer and including a plurality of vias so as to be electrically connected to the through via; and a solder resist layer applied onto a lower portion of the core layer so that a lower surface of the through via is partially exposed.
Abstract translation: 本发明公开了一种印刷电路板，其能够通过使嵌入电气装置的不对称积聚结构减少整个层数来实现薄片化，该印刷电路板包括：芯层，其包括形成在其中的空腔， 电气装置被嵌入，并且在其上表面和下表面上形成电路图案和焊盘; 通孔形成在芯层中，以将芯层的上垫和下焊盘彼此连接; 多个绝缘层，其堆叠在所述芯层上并且包括多个通孔，以便电连接到所述通孔; 以及涂覆在芯层的下部上的阻焊层，使得通孔的下表面部分露出。
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公开(公告)号：US20160021755A1
公开(公告)日：2016-01-21
申请号：US14801076
申请日：2015-07-16
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jung Han LEE , Tae Hong MIN , Yul Kyo CHUNG , Young Gwan KO , Myung Sam KANG
CPC classification number: H05K1/185 , H01L2224/16227 , H01L2224/16235 , H01L2224/16265 , H05K1/0231 , H05K3/3436 , H05K3/4644 , H05K2201/10015
Abstract: The present invention relates to a chip embedded substrate, which includes a substrate formed by alternately stacking an insulation layer and a circuit layer and an embedded chip equipped with a connection terminal and mounted inside the substrate, wherein the connection terminal is protruded from the insulation layer placed on the outermost layer of the substrate, and a connection surface to be connected to an electronic component is exposed to the outside.
Abstract translation: 芯片嵌入式基板技术领域本发明涉及一种芯片嵌入式基板，其包括通过交替堆叠绝缘层和电路层而形成的基板和配备有连接端子的嵌入式芯片，其安装在基板内部，其中，连接端子从绝缘层突出 放置在基板的最外层，并且要连接到电子部件的连接表面暴露于外部。
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