中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

9 records (took 0.021 seconds)

    APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE
    5.
    发明申请
    APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE 审中-公开
    用于制造基板的装置和方法

    公开(公告)号：US20130064994A1

    公开(公告)日：2013-03-14

    申请号：US13669873

    申请日：2012-11-06

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Dong Joo SHIN ,  Choon Keun LEE ,  Sung Taek LIM

    IPC: B05D3/00

    CPC classification number: B05D3/002 ,  H01L21/67109 ,  H01L21/6776 ,  H05K3/022 ,  H05K3/146 ,  H05K3/381 ,  H05K2203/085 ,  H05K2203/1545

    Abstract: Disclosed herein is an apparatus for manufacturing a substrate, including: a first chamber supplying an insulation layer; a second chamber including a roughening roller roughening at least one side of the insulation layer supplied from the first chamber, an evaporator depositing a metal layer on the roughened insulation layer, and a pressing roller pressing the insulation layer and the metal layer; and a third chamber storing the insulation layer including the metal layer formed thereon, the insulation layer being taken out from the second chamber. The apparatus for manufacturing a substrate is advantageous in that substrates are continuously produced, thus increasing the productivity of the substrates and preventing the substrates from being contaminated by the air.

    Abstract translation: 本文公开了一种用于制造衬底的装置，包括：提供绝缘层的第一腔室; 第二室，包括使从第一室供应的绝缘层的至少一侧粗糙化的粗糙化辊;在粗糙化绝缘层上沉积金属层的蒸发器;以及按压绝缘层和金属层的加压辊; 以及第三室，存储包括形成在其上的金属层的绝缘层，绝缘层从第二室取出。 用于制造基板的装置的优点在于，连续地生产基板，从而提高基板的生产率并防止基板被空气污染。

    SEMICONDUCTOR PACKAGE
    8.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20210005532A1

    公开(公告)日：2021-01-07

    申请号：US16589652

    申请日：2019-10-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Hyun KWON ,  Hyung Kyu KIM ,  Seong Chan PARK ,  Hye Lee KIM ,  Choon Keun LEE

    IPC: H01L23/42 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  C09J133/10

    Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.

Patent Agency Ranking