Abstract:
A printed circuit board including: a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer, and including a first wiring portion and a second wiring portion; and a second insulating layer disposed on the upper surface of the first insulating layer, having a cavity exposing an upper surface of the second wiring portion, and including a first insulating portion covering the first wiring portion and a second insulating portion whose upper surface is exposed from the cavity, wherein one or more gaps are provided between the second wiring portion and the second insulating portion.
Abstract:
Disclosed herein are an adhesive member for manufacturing a printed circuit board, a printed circuit board, and a method of manufacturing the same. The printed circuit board includes a base substrate, an insulating layer formed on the base substrate, a primer layer formed on the insulating layer, and a circuit layer formed on the primer layer.
Abstract:
Embodiments of the invention provide a touch sensor including a window substrate and a bezel layer formed on outer edges of one surface of the window substrate, wherein the bezel layer includes a printed layer formed on the window substrate, a medium layer formed on the printed layer and having a refractive index lower than that of the printed layer, and a reflective layer formed on the medium layer. According to at least one embodiment, the bezel layer formed on the window substrate is reduced in thickness and various colors are more easily implemented.
Abstract:
The present invention relates to an interlayer insulating composition for a multilayer printed wiring board including: an epoxy resin including a naphthalene-modified epoxy resin, a cresol novolac epoxy resin, and a rubber-modified epoxy resin; a thermoplastic resin; a curing agent; and an inorganic filler and a multilayer printed wiring board including the same as an insulating layer. The present invention can provide an insulating composition excellent in adhesion between an insulating layer and a Cu layer to secure normal operation and reliability of a final substrate. Further, since the present invention properly includes an epoxy resin and a thermoplastic resin regardless of an increase in the content of an inorganic filler, it is possible to secure the reliability of the substrate by preventing an insulating film from being brittle and improving toughness of the insulating film while maintaining a low thermal expansion rate.
Abstract:
This invention relates to a photo-sensitive resin composition for a bezel of a touch screen module, including a colorant composed of surface-modified TiO2, a binder resin, a dispersing agent, a photopolymerizable compound, a photoinitiator, and a solvent, and having a viscosity of 2˜30 cps and a solid content of 50˜90 mass %, and to a bezel for a touch screen module using the same. The photo-sensitive resin composition can exhibit superior dispersion stability, and even when a thin pattern layer is formed therefrom, whiteness represented by L* can be 85% or more, and thus the photo-sensitive resin composition can be effectively utilized in a bezel for a touch screen module.
Abstract:
There is provided a touch screen module including a glass substrate, a first photosensitive resin layer formed on the glass substrate and a bezel including a second photosensitive resin layer formed on the first photosensitive resin layer, and transparent electrodes simultaneously formed on both the glass substrate and the bezel. A residue phenomenon in which pigment particles included in the bezel remain on a surface of the glass substrate after exposure and development may be prevented.