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    Multilayer electronic component
    1.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US11804331B2

    公开(公告)日：2023-10-31

    申请号：US17375323

    申请日：2021-07-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyoung Uk Kim ,  Seung In Baik ,  Ji Su Hong ,  Eun Ha Jang ,  Jae Sung Park ,  Chung Eun Lee

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218

    Abstract: A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.

    MULTILAYER ELECTRONIC COMPONENT
    2.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220157530A1

    公开(公告)日：2022-05-19

    申请号：US17375323

    申请日：2021-07-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyoung Uk Kim ,  Seung In Baik ,  Ji Su Hong ,  Eun Ha Jang ,  Jae Sung Park ,  Chung Eun Lee

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008

    Abstract: A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.

    DIELECTRIC COMPOSITION AND MULTILAYER CAPACITOR
    4.
    发明申请
    DIELECTRIC COMPOSITION AND MULTILAYER CAPACITOR 有权

    公开(公告)号：US20220181081A1

    公开(公告)日：2022-06-09

    申请号：US17474510

    申请日：2021-09-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Sung Park ,  Jeong Yun Park ,  Hyoung Uk Kim ,  Jong Han Kim ,  Chung Eun Lee

    IPC: H01G4/12 ,  H01G4/30 ,  C04B35/468

    Abstract: A dielectric composition and a multilayer capacitor including the same are provided. The dielectric composition includes a BaTiO3-base main component, a first subcomponent including an Nb component and a Gd component, a second subcomponent including an Mg component, and a third subcomponent including a Ba component and a Ca component. The first subcomponent is included in an amount of 4 moles or less per 100 moles of the main component. In the first subcomponent, a molar content of Nb and a molar content of Gd satisfy 0.33≤Nb/Gd, and in the third subcomponent, a molar content of Ba and a molar content of Ca satisfy 0.2≤Ca/(Ba+Ca).

    Multilayered ceramic electronic component and fabrication method thereof
    6.
    发明授权
    Multilayered ceramic electronic component and fabrication method thereof 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US08711545B2

    公开(公告)日：2014-04-29

    申请号：US13950676

    申请日：2013-07-25

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Chung Eun Lee ,  Jae Yeol Choi ,  Doo Young Kim ,  Wi Heon Kim

    IPC: H01G4/06

    CPC classification number: H01G4/30 ,  H01C7/008 ,  H01C7/10 ,  H01G4/005 ,  H01G4/12 ,  H01L41/0471 ,  H01L41/273

    Abstract: A multilayered ceramic electronic component includes: a ceramic element having a plurality of dielectric layers laminated therein; first inner electrodes formed on the dielectric layers disposed in upper and lower portions in the ceramic element, the width of a portion of each of the first inner electrodes exposed from one end face of the ceramic element being less than that of a portion thereof disposed within the ceramic element; and second inner electrodes formed on the dielectric layers disposed in the middle portion in the ceramic element, the width of a portion of each of the second inner electrodes exposed from one end face of the ceramic element being equal to that of a portion thereof disposed within the ceramic element.

    Abstract translation: 多层陶瓷电子部件包括：陶瓷元件，其中层叠有多个电介质层; 形成在陶瓷元件的上部和下部的电介质层上的第一内部电极，从陶瓷元件的一个端面露出的每个第一内部电极的一部分的宽度小于其内部的部分的宽度 陶瓷元件; 以及形成在设置在陶瓷元件的中间部分的电介质层上的第二内部电极，从陶瓷元件的一个端面露出的每个第二内部电极的一部分的宽度等于设置在陶瓷元件中的部分的宽度 陶瓷元件。

    Multilayer capacitor
    9.
    发明授权
    Multilayer capacitor 有权

    公开(公告)号：US11626246B2

    公开(公告)日：2023-04-11

    申请号：US17399564

    申请日：2021-08-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Ho Lee ,  Hong Seok Kim ,  Dong Chan Kim ,  Eun Jeong Cho ,  Chung Eun Lee ,  Hye Bin Kim ,  Eun Joo Choi ,  Sun Ju Hwang

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/10 ,  H01G4/232

    Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are provided and a plurality of internal electrodes are stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body and connected to the plurality of internal electrodes. The body includes a high resistance portion disposed in at least one region between the dielectric layer and the internal electrode and inside the dielectric layer and having electric resistance higher than electric resistance of the internal electrode, and the high resistance portion and the plurality of internal electrodes include the same metal component and the same metal oxide component.

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