公开(公告)号：US20150250050A1

公开(公告)日：2015-09-03

申请号：US14339155

申请日：2014-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Bo LEE ,  Do Wan Kim ,  Soon Jin Cho

IPC: H05K1/03 ,  H05K3/10 ,  H05K3/32 ,  H05K3/30 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82005 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/4647 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/4913 ,  H01L2224/83005

Abstract: Disclosed herein are an embedded board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the embedded board includes: an outer layer insulating layer; an electronic device disposed inside the outer layer insulating layer; an outer layer circuit layer formed to protrude from one surface of the outer layer insulating layer; a first via formed on the outer layer insulating layer and electrically connecting the electronic device to the outer layer circuit layer; and a build up layer formed on the other surface of the outer layer insulating layer and including a build up insulating layer and a build up circuit layer.

Abstract translation: 这里公开了嵌入式电路板及其制造方法。 根据本发明的优选实施例，嵌入式板包括：外层绝缘层; 设置在所述外层绝缘层内的电子装置; 形成为从外层绝缘层的一个表面突出的外层电路层; 形成在所述外层绝缘层上并将所述电子器件电连接到所述外层电路层的第一通孔; 以及形成在外层绝缘层的另一个表面上并包括堆积绝缘层和积聚电路层的堆积层。

公开(公告)号：US20140037862A1

公开(公告)日：2014-02-06

申请号：US13671377

申请日：2012-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Bo Lee ,  Do Wan Kim ,  Cheol Ho Choi ,  Chang Sup Ryu

IPC: H05K3/18

CPC classification number: H05K3/18 ,  H01L23/13 ,  H01L2924/0002 ,  H05K3/0073 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2203/107 ,  H05K2203/1476 ,  H01L2924/00

Abstract: Disclosed herein is a method for manufacturing a printed circuit board for forming a solder resist of an outermost layer having a step structure by performing laser machining or exposing and developing processes.

Abstract translation: 本发明公开了一种制造印刷电路板的方法，该印刷电路板通过执行激光加工或曝光和显影工艺来形成具有台阶结构的最外层的阻焊剂。