公开(公告)号：US20140030855A1

公开(公告)日：2014-01-30

申请号：US14039392

申请日：2013-09-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ey Yong KIM ,  Young Hwan SHIN ,  Soon Jin CHO ,  Jong Yong KIM ,  Jin Seok LEE

IPC: H01L21/56

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of manufacturing a flip chip package includes: providing a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is to be mounted, and a connection pad disposed outside the mounting region; forming a resin layer on the board; forming a trench by removing a part of the resin layer or forming an uneven portion at a portion of a surface of the resin layer; forming, on the trench or uneven portion, a dam member preventing leakage of an underfill between the mounting region and the connection pad; and mounting the electronic device on the mounting region.

Abstract translation: 一种制造倒装芯片封装的方法，包括：提供一个板，其包括布置在其上将要安装电子器件的板的安装区域内的导电焊盘和设置在安装区域外部的连接焊盘; 在板上形成树脂层; 通过去除树脂层的一部分或在树脂层的表面的一部分处形成凹凸部来形成沟槽; 在沟槽或不平坦部分上形成防止底部填充物在安装区域和连接焊盘之间泄漏的阻挡构件; 并将电子装置安装在安装区域上。