公开(公告)号：US20140186581A1

公开(公告)日：2014-07-03

申请号：US14140398

申请日：2013-12-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seok Kyu LEE ,  Takayuki HAZE ,  Soon Jin CHO

IPC: H05K1/05 ,  H05K3/00

CPC classification number: H05K3/381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/022 ,  H05K3/4655 ,  Y10T428/24355

Abstract: Disclosed herein are a primer-coated copper foil and a method for producing the same. The primer-coated copper foil includes a copper foil layer; and a primer resin layer having a first surface on which the copper foil layer is coated and a second surface as a counter side on which a roughness is formed, so that the primer-coated copper foil can exhibit excellent adhesive strength.

Abstract translation: 本文公开了底漆涂覆铜箔及其制备方法。 底漆涂布铜箔包括铜箔层; 以及具有涂布有铜箔层的第一表面和形成有粗糙度的对置面的第二表面的底漆树脂层，使得底漆涂布的铜箔可以表现出优异的粘合强度。

公开(公告)号：US20150118603A1

公开(公告)日：2015-04-30

申请号：US14224112

申请日：2014-03-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Jo HONG ,  Oh Hi LEE ,  Soon Jin CHO

IPC: G03F1/00 ,  G03F7/30

CPC classification number: G03F7/30 ,  G03F1/00 ,  G03F1/54 ,  H01L2224/11 ,  H01L2224/73204

Abstract: Embodiments of the invention provide a photo mask capable of simultaneously forming trenches for preventing an under-fill leakage in a process of forming an opening of a solder resist. In accordance with at least one embodiment, the photo mask includes a transparent base material having a non-transmitting film formed on one surface thereof, a semi-transmitting region formed by performing selective etching using a laser on the transparent base material, a transmitting region and a non-transmitting region formed on the transparent base material together with the semi-transmitting region, and an opening of a solder resist and trenches for preventing a leakage of an under-fill liquid or EMC mold may be simultaneously formed using the photo mask.

Abstract translation: 本发明的实施例提供一种能够在形成阻焊剂的开口的过程中同时形成沟槽以防止欠填漏的光掩模。 根据至少一个实施例，光掩模包括透明基材，其具有在其一个表面上形成的非透光膜，通过使用激光在透明基材上进行选择性蚀刻而形成的半透射区域，透射区域 以及与半透射区域一起形成在透明基材上的非透射区域，并且可以使用光掩模同时形成用于防止未充填液体或EMC模具泄漏的阻焊剂和沟槽的开口 。

公开(公告)号：US20140347834A1

公开(公告)日：2014-11-27

申请号：US14285882

申请日：2014-05-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seok Kyu LEE ,  Takayuki HAZE ,  Soon Jin CHO

IPC: H05K1/18 ,  H05K1/03 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H05K3/007 ,  H05K3/305 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/10015 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T29/4913

Abstract: An electronic component embedded printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core having a cavity formed therein; an electronic component unit embedded in the cavity, including a plurality of electronic components, and having a coating layer formed on an outer peripheral surface of the electronic component unit to fix the plurality of electronic components; and an insulating layer laminated at least on the top of the core. An outer layer circuit pattern may be formed on the insulating layer.

Abstract translation: 一种电子元件嵌入式印刷电路板及其制造方法。 印刷电路板包括：形成有腔的芯; 嵌入在所述空腔中的电子部件单元，包括多个电子部件，并且具有形成在所述电子部件单元的外周面上的被覆层，以固定所述多个电子部件; 以及至少层叠在芯的顶部上的绝缘层。 可以在绝缘层上形成外层电路图案。

公开(公告)号：US20140185254A1

公开(公告)日：2014-07-03

申请号：US13845020

申请日：2013-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jee Soo MOK ,  Jong Seok BAE ,  Soon Jin CHO ,  Duck Young MAENG

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/28 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/26175 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/92225 ,  H01L2924/12042 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Disclosed herein is a printed circuit board including: a base substrate in which a connection pad is formed; a solder resist layer formed on the base substrate and comprising a trench exposing a surface of the base substrate; and a dam formed on the solder resist layer and burying the inside of the trench.

Abstract translation: 这里公开了一种印刷电路板，包括：基底，其中形成连接垫; 阻焊层，形成在所述基底基板上并且包括暴露所述基底基板的表面的沟槽; 以及形成在阻焊层上并埋设沟槽内部的坝。

公开(公告)号：US20140030855A1

公开(公告)日：2014-01-30

申请号：US14039392

申请日：2013-09-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ey Yong KIM ,  Young Hwan SHIN ,  Soon Jin CHO ,  Jong Yong KIM ,  Jin Seok LEE

IPC: H01L21/56

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of manufacturing a flip chip package includes: providing a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is to be mounted, and a connection pad disposed outside the mounting region; forming a resin layer on the board; forming a trench by removing a part of the resin layer or forming an uneven portion at a portion of a surface of the resin layer; forming, on the trench or uneven portion, a dam member preventing leakage of an underfill between the mounting region and the connection pad; and mounting the electronic device on the mounting region.

Abstract translation: 一种制造倒装芯片封装的方法，包括：提供一个板，其包括布置在其上将要安装电子器件的板的安装区域内的导电焊盘和设置在安装区域外部的连接焊盘; 在板上形成树脂层; 通过去除树脂层的一部分或在树脂层的表面的一部分处形成凹凸部来形成沟槽; 在沟槽或不平坦部分上形成防止底部填充物在安装区域和连接焊盘之间泄漏的阻挡构件; 并将电子装置安装在安装区域上。