公开(公告)号：US10418178B2

公开(公告)日：2019-09-17

申请号：US15684645

申请日：2017-08-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo Kim ,  Jong Ho Lee ,  Min Gi Sin ,  Hak Kwan Kim ,  Chin Mo Kim ,  Chi Hwa Lee ,  Hong Seok Kim ,  Woo Sup Kim ,  Chang Hwa Park

IPC: C04B35/468 ,  C04B35/628 ,  H01G4/10 ,  H01G4/12 ,  H01G4/33 ,  H01L21/00 ,  H01G4/30 ,  C01G23/00 ,  H01G4/232 ,  H01G4/248

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：US09155197B2

公开(公告)日：2015-10-06

申请号：US13713747

申请日：2012-12-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sun Cheol Lee ,  Woo Sup Kim ,  Dong Gun Kim ,  Kyeong Jun Kim ,  Kyu Ho Lee

IPC: H01G4/06 ,  H05K1/18 ,  H01G4/12 ,  H01L41/083 ,  H05K1/03 ,  H01G4/30 ,  H01G2/06 ,  H01G2/24 ,  H01C7/10 ,  H01C7/00

CPC classification number: H05K1/181 ,  H01C7/008 ,  H01C7/10 ,  H01G2/06 ,  H01G2/24 ,  H01G4/06 ,  H01G4/12 ,  H01G4/30 ,  H01L41/083 ,  H05K1/0306 ,  Y02P70/611

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

公开(公告)号：US10580575B2

公开(公告)日：2020-03-03

申请号：US16267534

申请日：2019-02-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo Kim ,  Jong Ho Lee ,  Min Gi Sin ,  Hak Kwan Kim ,  Chin Mo Kim ,  Chi Hwa Lee ,  Hong Seok Kim ,  Woo Sup Kim ,  Chang Hwa Park

IPC: C04B35/468 ,  C04B35/628 ,  H01G4/10 ,  H01G4/12 ,  H01G4/33 ,  C01G23/00 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：USRE49923E1

公开(公告)日：2024-04-16

申请号：US17354172

申请日：2021-06-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo Kim ,  Jong Ho Lee ,  Min Gi Sin ,  Hak Kwan Kim ,  Chin Mo Kim ,  Chi Hwa Lee ,  Hong Seok Kim ,  Woo Sup Kim ,  Chang Hwa Park

IPC: H01G4/12 ,  C01G23/00 ,  C04B35/468 ,  C04B35/628 ,  H01G4/10 ,  H01G4/30 ,  H01G4/33 ,  H01G4/232 ,  H01G4/248

CPC classification number: H01G4/1227 ,  C01G23/00 ,  C01G23/006 ,  C04B35/4682 ,  C04B35/62805 ,  C04B35/6281 ,  C04B35/62821 ,  H01G4/10 ,  H01G4/30 ,  H01G4/33 ,  C01P2004/64 ,  C01P2004/80 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3234 ,  C04B2235/3244 ,  C04B2235/3248 ,  C04B2235/3249 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3275 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3293 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/442 ,  H01G4/232 ,  H01G4/248

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：US10600572B2

公开(公告)日：2020-03-24

申请号：US15684645

申请日：2017-08-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo Kim ,  Jong Ho Lee ,  Min Gi Sin ,  Hak Kwan Kim ,  Chin Mo Kim ,  Chi Hwa Lee ,  Hong Seok Kim ,  Woo Sup Kim ,  Chang Hwa Park

IPC: C04B35/468 ,  C04B35/628 ,  H01G4/10 ,  H01G4/12 ,  H01G4/33 ,  H01L21/00 ,  H01G4/30 ,  C01G23/00 ,  H01G4/232 ,  H01G4/248

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

公开(公告)号：US10269492B2

公开(公告)日：2019-04-23

申请号：US14799461

申请日：2015-07-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kum Jin Park ,  Chang Hak Choi ,  Chi Hwa Lee ,  Min Gi Sin ,  Woo Sup Kim ,  Jong Hoon Yoo

IPC: H01G4/008 ,  H01G4/12 ,  H01G4/30 ,  C04B35/468

Abstract: A multilayer ceramic electronic component and a method of manufacturing the same are provided. The multilayer ceramic electronic component includes: a ceramic body including dielectric layers; and internal electrodes disposed on the dielectric layers within the ceramic body and containing a ceramic material trapped therein. The ceramic material is a dielectric material doped with an additive.