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    NICKEL PLATING SOLUTION AND METHOD FOR FORMING NICKEL PLATING LAYER USING THE SAME
    1.
    发明申请
    NICKEL PLATING SOLUTION AND METHOD FOR FORMING NICKEL PLATING LAYER USING THE SAME 审中-公开
    镍镀层解决方案和使用其形成镍镀层的方法

    公开(公告)号：US20140069816A1

    公开(公告)日：2014-03-13

    申请号：US13831061

    申请日：2013-03-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Mi Geum KIM ,  Hyo Seung NAM

    IPC: C25D3/12 ,  C25D7/12

    CPC classification number: C25D3/12 ,  C25D5/12 ,  C25D7/12

    Abstract: Disclosed herein are a nickel plating solution and a method for forming a nickel layer on an external electrode of a chip component by using the nickel plating solution, the nickel plating solution including: a nickel ion; a chloride ion; and a pH buffer, wherein the pH buffer is used by mixing an inorganic acid, and an organic acid and a salt thereof, so that the damage to a body of the chip component can be reduced by containing organic acid and a salt thereof in the nickel plating solution for forming the nickel plating layer on the external electrode of the chip component having a body formed of a material including ferrite or manganese oxide.

    Abstract translation: 本发明公开了一种镍电镀溶液和通过使用镍电镀液在芯片部件的外部电极上形成镍层的方法，所述镍电镀液包括：镍离子; 氯离子; 和pH缓冲剂，其中通过混合无机酸和有机酸及其盐来使用pH缓冲剂，使得通过在有机酸和其盐中含有有机酸及其盐，可以降低对芯片组分的体的损害 用于在具有由铁氧体或氧化锰的材料形成的本体的芯片部件的外部电极上形成镍镀层的镍电镀液。

    MULTILAYERED CAPACITOR
    2.
    发明申请
    MULTILAYERED CAPACITOR 有权

    公开(公告)号：US20210265115A1

    公开(公告)日：2021-08-26

    申请号：US17318938

    申请日：2021-05-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Mi Geum KIM ,  Byeong Cheol MOON ,  Kun Hoi KOO ,  Jung Min KIM

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248

    Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.

    COIL COMPONENT
    3.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20230014633A1

    公开(公告)日：2023-01-19

    申请号：US17848814

    申请日：2022-06-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Rock LEE ,  Mi Geum KIM

    IPC: H01F27/29 ,  H01F27/255

    Abstract: A coil component includes: a body containing magnetic metal particles and an insulating resin; a coil portion disposed in the body; and first and second external electrodes disposed on the body while being spaced apart from each other and connected to opposite end portions of the coil portion, respectively, wherein a surface of the body has first and second regions in which the first and second external electrodes are disposed, respectively, and a third region in which the first and second external electrodes are not disposed, some of the magnetic metal particles are exposed to the third region of the body, and a monomolecular organic material having a hydrophobic portion is disposed at an exposed surface of the magnetic metal particle exposed to the third region of the body.

    PRINTED CIRCUIT BOARD
    7.
    发明公开
    PRINTED CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240196528A1

    公开(公告)日：2024-06-13

    申请号：US18138893

    申请日：2023-04-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sangik CHO ,  Mi Jung PARK ,  Mi Geum KIM ,  Yong Su LEE ,  Sung HAN ,  Jong Eun PARK

    IPC: H05K1/09 ,  H05K1/05 ,  H05K1/11 ,  H05K3/18

    CPC classification number: H05K1/09 ,  H05K1/056 ,  H05K1/116 ,  H05K3/181

    Abstract: A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.

    COIL COMPONENT
    9.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20230223182A1

    公开(公告)日：2023-07-13

    申请号：US17991179

    申请日：2022-11-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Mi Geum KIM ,  Jae Hun KIM

    IPC: H01F27/29 ,  H01F27/28

    CPC classification number: H01F27/29 ,  H01F27/2804 ,  H01F2027/2809

    Abstract: A coil component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connecting the first and second surfaces to each other and opposing each other in a second direction; a substrate disposed in the body; a coil unit disposed on the substrate, and including a coil pattern, lead-out portions connected to the coil pattern and contacting the first surface of the body while being spaced apart from the third and fourth surfaces of the body, respectively, and sub lead-out portions spaced apart from the coil pattern; and external electrodes disposed on the first surface of the body and connected to the lead-out portions, respectively, wherein each of the sub lead-out portions occupies a smaller volume within the body than each of the lead-out portions.

    COIL COMPONENT
    10.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20190287711A1

    公开(公告)日：2019-09-19

    申请号：US16174214

    申请日：2018-10-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun KIM ,  Ji Hyung JUNG ,  Mi Geum KIM ,  Ji Man RYU ,  Do Young JUNG ,  Joung Gul RYU

    IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

    Abstract: A coil component includes a body including a coil, and an external electrode disposed on an external surface of the body and connected to the coil, wherein the body includes a support member supporting the coil and including a through-hole and a via hole spaced apart from the through-hole, the coil includes a coil body and a lead portion connecting the coil body and the external electrode to each other, and a support thin film layer is interposed between one surface of the support member and one surface of the lead portion facing the one surface.

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