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Patent Agency Ranking
公开(公告)号：US20230215642A1
公开(公告)日：2023-07-06
申请号：US17961844
申请日：2022-10-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sin Il GU , Jin Hyung LIM , Kang Ha LEE , Jung Won LEE
CPC classification number: H01G4/2325 , H01G4/30
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a first portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions, the insulating layer including a first glass and a first oxide including aluminum (Al).
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公开(公告)号：US20250166913A1
公开(公告)日：2025-05-22
申请号：US18907881
申请日：2024-10-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Ah KIM , Kang Ha LEE , Eun Byeol CHOI , Hong Je CHOI , Hong Seok KIM , Bum Suk KANG
Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer in a first direction, and external electrodes including band portions disposed on first and second surfaces of the body, connection portions disposed on third and fourth surfaces of the body, and edge portions connecting the band portions and the connection portions and disposed at edges connecting the first and second surfaces and the third and fourth surfaces of the body, wherein the external electrodes includes first external electrode layers connected to the first and second internal electrodes and including first glass, and second external electrode layers disposed on the first external electrode layer of the edge portions and including second glass, and wherein the second glass includes Fe, and the first glass does not include Fe.
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公开(公告)号：US20220208462A1
公开(公告)日：2022-06-30
申请号：US17523198
申请日：2021-11-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jun Hyeong KIM , Myung Jun PARK , Jin Soo PARK , Yeon Song KANG , Eun Jin KIM , Kyu Sik PARK , Kang Ha LEE
Abstract: A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.
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公开(公告)号：US20230238182A1
公开(公告)日：2023-07-27
申请号：US17943606
申请日：2022-09-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jong CHOI , Yoo Jeong LEE , Chung Yeol LEE , Kwang Yeun WON , So Jung AN , Kang Ha LEE , Woo Kyung SUNG , Myung Jun PARK , Jong Ho LEE
CPC classification number: H01G4/224 , H01G4/30 , H01G4/248 , H01G4/2325
Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.
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公开(公告)号：US20230223195A1
公开(公告)日：2023-07-13
申请号：US17972722
申请日：2022-10-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Jong CHOI , Yoo Jeong LEE , Chung Yeol LEE , Kwang Yeun WON , So Jung AN , Kang Ha LEE , Woo Kyung SUNG , Myung Jun PARK , Jong Ho LEE
CPC classification number: H01G4/2325 , H01G4/30 , H01G4/012
Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.
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