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    FAN-OUT SENSOR PACKAGE
    2.
    发明申请
    FAN-OUT SENSOR PACKAGE 审中-公开

    公开(公告)号：US20190229139A1

    公开(公告)日：2019-07-25

    申请号：US16132757

    申请日：2018-09-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hyun LIM ,  Yoon Seok SEO ,  Kyung Moon JUNG ,  Eun Jin KIM

    IPC: H01L27/146

    Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

    MULTILAYER ELECTRONIC COMPONENT
    3.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220208462A1

    公开(公告)日：2022-06-30

    申请号：US17523198

    申请日：2021-11-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jun Hyeong KIM ,  Myung Jun PARK ,  Jin Soo PARK ,  Yeon Song KANG ,  Eun Jin KIM ,  Kyu Sik PARK ,  Kang Ha LEE

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/008

    Abstract: A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.

    COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    线圈电子元件及其制造方法

    公开(公告)号：US20170062116A1

    公开(公告)日：2017-03-02

    申请号：US15089034

    申请日：2016-04-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byung Soo KANG ,  Eo Jin CHOI ,  Eun Jin KIM

    IPC: H01F27/25 ,  H01F41/02 ,  H01F41/071 ,  H01F27/28

    CPC classification number: H01F27/25 ,  H01F3/10 ,  H01F17/045 ,  H01F27/255 ,  H01F41/0246 ,  H01F2003/106 ,  H01F2017/048

    Abstract: A coil electronic component includes a magnetic body having a core part and a coil wound around the core part. The core part includes mixtures of magnetic metal material and resin. The magnetic body includes a first region adjacent to the coil and a second region adjacent to an outer surface of the magnetic body. Additionally, magnetic metal material of the first region adjacent to the coil has magnetic permeability higher than that of magnetic metal material of the second region adjacent to the outer surface of the magnetic body.

    Abstract translation: 线圈电子部件包括具有芯部的磁性体和缠绕在芯部上的线圈。 核心部分包括磁性金属材料和树脂的混合物。 磁体包括与线圈相邻的第一区域和与磁体的外表面相邻的第二区域。 此外，与线圈相邻的第一区域的磁性金属材料的磁导率高于与磁体外表面相邻的第二区域的磁性金属材料。

    SEMICONDUCTOR PACKAGE
    6.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20190244885A1

    公开(公告)日：2019-08-08

    申请号：US16105289

    申请日：2018-08-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Jin KIM ,  Han KIM

    IPC: H01L23/498 ,  H01L23/31 ,  H01L23/043

    Abstract: A semiconductor package includes a connection member having a first surface and a second surface disposed to oppose each other and including an insulating member having a plurality of insulating layers and a plurality of redistribution layers disposed on the plurality of insulating layers, respectively; a semiconductor chip disposed on the first surface of the connection member and having connection pads electrically connected to the plurality of redistribution layers; and an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, wherein at least one of the plurality of redistribution layers includes a dummy electrode pattern in which a plurality of holes are arranged, and each of the plurality of holes has a shape including a plurality of protruding regions that protrude externally from different positions.

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