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    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20160087189A1

    公开(公告)日：2016-03-24

    申请号：US14723448

    申请日：2015-05-27

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Kyoung No LEE ,  Kyu Ha LEE ,  Eun Joo CHOI ,  Jun Hyeong KIM ,  Byung Jun JEON

    IPC分类号： H01L41/083 ,  H01L41/273 ,  H01L41/047

    CPC分类号： H01L41/273 ,  H01G4/0085 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0471 ,  H01L41/0472

    摘要： There is provided a multilayer ceramic electronic component including: a ceramic body in which internal electrodes containing a first electrode material and dielectric layers are alternately disposed; external electrodes provided on outer surfaces of the ceramic body and containing a second electrode material; and diffusion parts each disposed to be connected to one end of the internal electrode and the external electrode and containing the first electrode material and the second electrode material mixed with each other, wherein the diffusion part includes an internal diffusion portion disposed within the ceramic body and an external diffusion portion protruding outside of the ceramic body.

    摘要翻译： 提供了一种多层陶瓷电子部件，其包括：陶瓷体，其中交替设置包含第一电极材料和电介质层的内部电极; 设置在陶瓷体的外表面并且包含第二电极材料的外部电极; 以及扩散部，其各自配置为与所述内部电极和所述外部电极的一端连接并且包含彼此混合的所述第一电极材料和所述第二电极材料，其中所述扩散部包括设置在所述陶瓷体内的内部扩散部， 突出在陶瓷体外侧的外部扩散部。

    MULTILAYER ELECTRONIC COMPONENT
    3.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220208462A1

    公开(公告)日：2022-06-30

    申请号：US17523198

    申请日：2021-11-10

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Jun Hyeong KIM ,  Myung Jun PARK ,  Jin Soo PARK ,  Yeon Song KANG ,  Eun Jin KIM ,  Kyu Sik PARK ,  Kang Ha LEE

    IPC分类号： H01G4/232 ,  H01G4/30 ,  H01G4/008

    摘要： A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.

    MULTILAYER ELECTRONIC COMPONENT
    4.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230215653A1

    公开(公告)日：2023-07-06

    申请号：US17890615

    申请日：2022-08-18

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Ha Jeong KIM ,  Kangha LEE ,  Jun Hyeong KIM ,  Eui Hyun JO ,  Myung Jun PARK

    IPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G2/06

    CPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G2/065

    摘要： A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
    多层陶瓷电容器及其制造方法

    公开(公告)号：US20160314902A1

    公开(公告)日：2016-10-27

    申请号：US14995089

    申请日：2016-01-13

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Kyoung No LEE ,  Hyun Hee GU ,  Kyu Ha LEE ,  Jun Hyeong KIM ,  Eun Joo CHOI

    IPC分类号： H01G4/248 ,  H01G4/232 ,  H01G4/008 ,  H01G4/30 ,  H01G4/12

    CPC分类号： H01G4/2325 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/30

    摘要： A multilayer ceramic capacitor includes a ceramic body including a plurality of dielectric layers and first and second internal electrodes; and first and second external electrodes connected to the first and second internal electrodes, respectively. The first and second external electrodes include: first and second connection layers including the same first conductive material as the first and second internal electrodes and formed on opposite surfaces of the ceramic body to be connected to the first and second internal electrodes, respectively; and first and second terminal layers including a second conductive material different from the first conductive material and formed on the opposite surfaces of the ceramic body to cover the first and second connection layers.

    摘要翻译： 多层陶瓷电容器包括：陶瓷体，其包括多个电介质层和第一和第二内部电极; 以及分别连接到第一和第二内部电极的第一和第二外部电极。 第一外部电极和第二外部电极包括：第一和第二连接层，包括与第一和第二内部电极相同的第一导电材料，并且分别形成在陶瓷体的相对表面上以分别连接到第一和第二内部电极; 以及第一和第二端子层，其包括与第一导电材料不同的第二导电材料，并且形成在陶瓷体的相对表面上以覆盖第一和第二连接层。