CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    陶瓷电子元件及其制造方法

    公开(公告)号:US20140022693A1

    公开(公告)日:2014-01-23

    申请号:US13887261

    申请日:2013-05-03

    CPC classification number: H01G4/30 H01G4/12 H01G4/2325

    Abstract: There is provided a ceramic electronic component, including: a ceramic body including a plurality of internal electrodes; a first external electrode layer electrically connected to the internal electrodes and formed on external surfaces of the ceramic body; a second external electrode layer including nickel (Ni), formed on the first external electrode layer; a metal coating layer including tin (Sn), formed on external surfaces of the first external electrode layer and the second external electrode layer; and a diffusion layer formed between the first and second external electrode layers and the metal coating layer.

    Abstract translation: 提供了一种陶瓷电子部件,包括:陶瓷体,其包括多个内部电极; 电连接到所述内部电极并形成在所述陶瓷体的外表面上的第一外部电极层; 形成在第一外部电极层上的包含镍(Ni)的第二外部电极层; 包含形成在所述第一外部电极层和所述第二外部电极层的外表面上的锡(Sn)的金属涂层; 以及形成在第一和第二外部电极层与金属被覆层之间的扩散层。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD
    2.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD 审中-公开
    多层陶瓷电子元件嵌入板上

    公开(公告)号:US20150016019A1

    公开(公告)日:2015-01-15

    申请号:US14331019

    申请日:2014-07-14

    CPC classification number: H01G4/30 H01G4/2325

    Abstract: A multilayer ceramic electronic component to be embedded in a board may include: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, respectively, with at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first external electrode layer containing a glass component and disposed on the end surface of the ceramic body and a second external electrode layer being glass-free and covering the first external electrode layer.

    Abstract translation: 要嵌入板中的多层陶瓷电子部件可以包括:多个电介质层堆叠的陶瓷体; 多个第一和第二内部电极分别通过陶瓷体的两个端面交替地暴露,其中介电层中的至少一个介于其间; 以及第一外部电极和第二外部电极,其分别设置在陶瓷体的端面上并电连接到第一和第二内部电极。 第一和第二外部电极中的每一个包括含有玻璃成分并设置在陶瓷体的端面上的第一外部电极层和不含玻璃的第二外部电极层,并覆盖第一外部电极层。

    MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF 有权
    多层陶瓷电容器及其制造方法

    公开(公告)号:US20150043124A1

    公开(公告)日:2015-02-12

    申请号:US14144414

    申请日:2013-12-30

    Abstract: There is provided a multilayer ceramic capacitor, including a ceramic body, a plurality of first and second internal electrodes, and first and second external electrodes, wherein the first and second external electrodes include first and second internal layers including first and second internal head portions and first and second internal bands formed on both main surfaces of the ceramic body, and first and second external layers including first and second external head portions and first and second external bands formed on the first and second internal bands and having a distance shorter than a distance of the first and second internal bands, the first and second external layers having viscosity higher than that of the first and second internal layers.

    Abstract translation: 提供了一种多层陶瓷电容器,其包括陶瓷体,多个第一和第二内部电极以及第一和第二外部电极,其中第一和第二外部电极包括包括第一和第二内部头部的第一和第二内部层,以及 形成在陶瓷体的两个主表面上的第一和第二内部带,以及包括第一和第二外部头部的第一和第二外部层,以及形成在第一和第二内部带上并具有比距离短的距离的第一和第二外部带 的第一和第二内部带,第一和第二外部层的粘度高于第一和第二内部层的粘度。

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电容器及其制造方法

    公开(公告)号:US20140185189A1

    公开(公告)日:2014-07-03

    申请号:US13949080

    申请日:2013-07-23

    CPC classification number: H01G4/30 H01G4/232 Y10T29/43 Y10T29/435

    Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein when it is defined that a thickness of a band of the first and second external electrodes is T1 and a thickness of the ceramic body is T2, a ratio (T1/T2) of the thickness of the band of the first or second external electrode to the thickness of the ceramic body is equal to or less than 0.18.

    Abstract translation: 提供了一种多层陶瓷电容器,包括:层叠有多个电介质层的陶瓷体; 多个第一和第二内部电极被形成为交替地暴露于陶瓷体的两个端面,其间插入介电层; 以及第一和第二外部电极,其形成在陶瓷体的两个端面上并电连接到第一和第二内部电极,其中当限定第一和第二外部电极的带的厚度为T1时,厚度为 陶瓷体是T2,第一或第二外部电极的带的厚度与陶瓷体的厚度的比(T1 / T2)等于或小于0.18。

    MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN
    5.
    发明申请
    MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN 有权
    嵌入板中的多层陶瓷电容器及其制造方法以及嵌入式多层陶瓷电容器的制造方法

    公开(公告)号:US20150022943A1

    公开(公告)日:2015-01-22

    申请号:US14067912

    申请日:2013-10-30

    CPC classification number: H01G4/30 H01G4/232

    Abstract: There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6.

    Abstract translation: 提供一种嵌入板的多层陶瓷电容器,包括:陶瓷体; 第一和第二内部电极通过陶瓷体的端面交替地暴露; 形成在陶瓷体的端面上的第一外部电极和第二外部电极; 以及包围第一外部电极和第二外部电极的第一和第二电镀层,其中当从第一或第二外部电极的另一端的带的一端到另一端的距离为“A”时, 从第一或第二镀层的表面垂直间隔开的距离陶瓷体内部的带的一端的距离陶瓷体的长度方向3μm的点的1/2×A与陶瓷体的长度方向相交, 第二镀层为“B”,B /A≥0.6。

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