公开(公告)号：US20240147622A1

公开(公告)日：2024-05-02

申请号：US18118217

申请日：2023-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Yoon LEE ,  Seung Eun LEE

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/14 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/185 ,  H05K2201/041 ,  H05K2201/10015 ,  H05K2201/10984 ,  H05K2201/2081

Abstract: A printed circuit board includes a first core portion in which a first passive component is embedded, a second core portion in which a second passive component is embedded, and a first bonding layer disposed between the first and second core portions and including first conductive particles connected to the first and second passive components.

公开(公告)号：US20140028336A1

公开(公告)日：2014-01-30

申请号：US13952206

申请日：2013-07-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Yoon LEE ,  Kyoung Ro Yoon ,  Kwang Seop Youm

IPC: G01R31/28

CPC classification number: G01R31/2843 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/4638

Abstract: Disclosed herein is a printed circuit board. In the printed circuit board provided with a router machining line to be partitioned into a unit region in which a plurality of unit substrates are formed and a dummy region enclosing the unit region, the unit region and the dummy region are formed in a plurality of layers and the printed circuit board includes detection coupons formed on each of the plurality of layers.

Abstract translation: 这里公开了一种印刷电路板。 在设置有分割成形成有多个单位基板的单位区域的路由器加工线的印刷电路板和包围单位区域的虚设区域中，单位区域和虚设区域形成为多层 并且印刷电路板包括形成在多层中的每一层上的检测试样。