公开(公告)号：US20140041907A1

公开(公告)日：2014-02-13

申请号：US13963863

申请日：2013-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ji Kim ,  Kyoung Ro Yoon ,  Joung Gul Ryu

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/09681

Abstract: Disclosed herein is a core substrate including at least one connection member formed therein; heat radiation members positioned to be adjacent to the connection member and divided in plural; and insulation members formed between the heat radiation members divided in plural and between the connection member and the heat radiation member.

Abstract translation: 本文公开了一种核心基板，其包括形成在其中的至少一个连接构件; 定位成与连接构件相邻并且被分成多个的热辐射构件; 以及绝缘构件，形成在被分成多个的散热构件之间以及连接构件和散热构件之间。

公开(公告)号：US20140028336A1

公开(公告)日：2014-01-30

申请号：US13952206

申请日：2013-07-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Yoon LEE ,  Kyoung Ro Yoon ,  Kwang Seop Youm

IPC: G01R31/28

CPC classification number: G01R31/2843 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/4638

Abstract: Disclosed herein is a printed circuit board. In the printed circuit board provided with a router machining line to be partitioned into a unit region in which a plurality of unit substrates are formed and a dummy region enclosing the unit region, the unit region and the dummy region are formed in a plurality of layers and the printed circuit board includes detection coupons formed on each of the plurality of layers.

Abstract translation: 这里公开了一种印刷电路板。 在设置有分割成形成有多个单位基板的单位区域的路由器加工线的印刷电路板和包围单位区域的虚设区域中，单位区域和虚设区域形成为多层 并且印刷电路板包括形成在多层中的每一层上的检测试样。

公开(公告)号：US20140060896A1

公开(公告)日：2014-03-06

申请号：US13827429

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gil Yong SHIN ,  Seung Lak Kim ,  Kyoung Ro Yoon

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/4644 ,  H05K2201/0338 ,  H05K2201/0341

Abstract: Disclosed herein is a printed circuit board, including: an insulating layer; a circuit layer formed on one surface of the insulating layer; and a via electrode penetrating through the insulating layer and being connected with the circuit layer, wherein the circuit layer is formed in a structure where different kinds of metal layers having different thermal conductivities are laminated.

Abstract translation: 这里公开了一种印刷电路板，包括：绝缘层; 形成在所述绝缘层的一个表面上的电路层; 以及穿过所述绝缘层并与所述电路层连接的通孔电极，其中所述电路层形成为层叠不同导热系数的不同种类的金属层的结构。