公开(公告)号：US20240196528A1

公开(公告)日：2024-06-13

申请号：US18138893

申请日：2023-04-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sangik CHO ,  Mi Jung PARK ,  Mi Geum KIM ,  Yong Su LEE ,  Sung HAN ,  Jong Eun PARK

IPC: H05K1/09 ,  H05K1/05 ,  H05K1/11 ,  H05K3/18

CPC classification number: H05K1/09 ,  H05K1/056 ,  H05K1/116 ,  H05K3/181

Abstract: A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.

公开(公告)号：US20240155212A1

公开(公告)日：2024-05-09

申请号：US18318273

申请日：2023-05-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Hwan KIM ,  Ju Ho KIM ,  Sang Hyun JI ,  Jung Hyun PARK ,  Nam Keun OH ,  Doo Seub SHIN ,  Dong Hoon LEE ,  Jong Eun PARK ,  Sangik CHO

IPC: H04N23/51 ,  G03B17/02 ,  H04N23/54

CPC classification number: H04N23/51 ,  G03B17/02 ,  H04N23/54

Abstract: A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.

公开(公告)号：US20210320426A1

公开(公告)日：2021-10-14

申请号：US16919609

申请日：2020-07-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sangik CHO ,  Ju Ho KIM

IPC: H01Q21/06 ,  H01Q1/38 ,  H01Q1/24 ,  H01Q9/04

Abstract: A antenna may include a first dielectric layer having a first surface and a second surface opposing the first surface; a second dielectric layer having a third surface, and a fourth surface opposing the third surface; an adhesive layer disposed between the second surface and the third surface and connecting the first dielectric layer to the second dielectric layer; a patch pattern disposed on the second surface and embedded in the adhesive layer; and a coupling pattern disposed on the fourth surface and having at least a portion overlapping the patch pattern on a plane. Each of the first dielectric layer and the second dielectric layer may include an organic binder and an inorganic filler.

公开(公告)号：US20210320421A1

公开(公告)日：2021-10-14

申请号：US16919625

申请日：2020-07-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sangik CHO ,  Ju Ho KIM

IPC: H01Q13/24 ,  H01Q1/38 ,  H01Q1/12 ,  H04B3/52 ,  H01Q19/08 ,  H01Q21/06

Abstract: An antenna includes a first dielectric layer having a first surface and a second surface, a second dielectric layer having a third surface and a fourth surface, and a reinforcing layer disposed between the first dielectric layer and the second dielectric layer and including an insulating material. A first adhesive layer is disposed between the first dielectric layer and the reinforcing layer, and a second adhesive layer is disposed between the second dielectric layer and the reinforcing layer. A first pattern layer is disposed on a surface of the first dielectric layer facing the first adhesive layer, and a second pattern layer is disposed on a surface of the second dielectric layer facing away from the second adhesive layer. The reinforcing layer has a first cavity penetrating a region between the first and second dielectric layers.