公开(公告)号：US20250089165A1

公开(公告)日：2025-03-13

申请号：US18673686

申请日：2024-05-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Hun NA ,  Dong Yong KIM ,  Mi Geum KIM ,  Mi Jung PARK ,  Yong Su LEE ,  Ho Seung JANG ,  Sang Ik CHO ,  Sung HAN ,  Sung Hoon KIM

IPC: H05K1/11 ,  H05K1/03

Abstract: A printed circuit board includes a glass layer, a through-hole penetrating through the glass layer, a seed layer provided along an inner wall of the through-hole, and a through-via disposed on the seed layer and filling the through-hole. The seed layer includes a carbon-based conductive material.

公开(公告)号：US20240196528A1

公开(公告)日：2024-06-13

申请号：US18138893

申请日：2023-04-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sangik CHO ,  Mi Jung PARK ,  Mi Geum KIM ,  Yong Su LEE ,  Sung HAN ,  Jong Eun PARK

IPC: H05K1/09 ,  H05K1/05 ,  H05K1/11 ,  H05K3/18

CPC classification number: H05K1/09 ,  H05K1/056 ,  H05K1/116 ,  H05K3/181

Abstract: A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.

公开(公告)号：US20240186059A1

公开(公告)日：2024-06-06

申请号：US18207372

申请日：2023-06-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Geum KIM ,  Jong Eun PARK ,  Sang Ik CHO ,  Mi Jung PARK ,  Yong Su LEE

IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F27/32

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/324 ,  H01F2017/002 ,  H01F2017/048

Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a first direction, a support member disposed in the body, the support member having a first surface and a second surface opposing each other, a coil disposed on the support member, a pad portion disposed on the first surface of the support member to be connected to the coil, an external electrode disposed on the first surface of the body, and a via electrode connecting the pad portion and the external electrode to each other.