公开(公告)号：US09161457B2

公开(公告)日：2015-10-13

申请号：US13827488

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Jae Lee ,  Byung Jae Kim ,  Sang Jin Kim ,  Soo Gil Shin ,  Seung Hee Cho

IPC: H05K3/30 ,  H04N5/225

CPC classification number: H05K3/30 ,  H04N5/2253 ,  H04N5/2254 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/0165 ,  Y02P70/613 ,  Y10T29/53174

Abstract: Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.

Abstract translation: 本文公开了一种用于制造相机模块的装置，该装置包括：从下方夹持PCB的基座夹具; 接合头拾取图像传感器并将图像传感器附接到PCB上; 以及壳体接合工具，其拾取壳体组件并将壳体组件附接到PCB上，使得附接到PCB上的图像传感器被容纳在壳体组件中，其中，基部夹具以基部夹具为张力的结构构成， 可沿垂直方向（Z轴方向）移动，使得当图像传感器被接合头拾取并附接到PCB上时，PCB的上表面是用于附接图像传感器和壳体组件的相同参考平面 。

公开(公告)号：US20130333207A1

公开(公告)日：2013-12-19

申请号：US13827488

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Jae LEE ,  Byung Jae Kim ,  Sang Jin Kim ,  Soo Gil Shin ,  Seung Hee Cho

IPC: H05K3/30

CPC classification number: H05K3/30 ,  H04N5/2253 ,  H04N5/2254 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/0165 ,  Y02P70/613 ,  Y10T29/53174

Abstract: Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.

Abstract translation: 本文公开了一种用于制造相机模块的装置，该装置包括：从下方夹持PCB的基座夹具; 接合头拾取图像传感器并将图像传感器附接到PCB上; 以及壳体接合工具，其拾取壳体组件并将壳体组件附接到PCB上，使得附接到PCB上的图像传感器被容纳在壳体组件中，其中，基部夹具以基部夹具为张力的结构构成， 可沿垂直方向（Z轴方向）移动，使得当图像传感器被接合头拾取并附接到PCB上时，PCB的上表面是用于附接图像传感器和壳体组件的相同参考平面 。