公开(公告)号：US20140175631A1

公开(公告)日：2014-06-26

申请号：US13779502

申请日：2013-02-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki LEE ,  Kwang Soo KIM ,  Young Hoon KWAK ,  Sun Woo YUN

IPC: H01L23/34 ,  H01L21/56

CPC classification number: H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/24 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other.

Abstract translation: 提供一种能够容易地制造的半导体模块及其制造方法，该半导体模块包括其上安装有至少一个电子元件的模块基板，至少一个固定到模块基板的外部连接端子和形成的壳体 通过联接第一壳体和第二壳体，其中第一壳体和第二壳体在模块衬底的两端容纳模块衬底并且彼此耦合。