公开(公告)号：US20150170804A1

公开(公告)日：2015-06-18

申请号：US14221822

申请日：2014-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hun CHO ,  Young Key Joo Kim ,  Chang Ho Lee ,  Byung Sung Kang

IPC: H01C1/148 ,  H01C1/012

CPC classification number: H01C7/003 ,  H01C7/18 ,  H01C17/006 ,  H01C17/06526 ,  H01C17/06533

Abstract: A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.

Abstract translation: 芯片电阻器可以包括：具有堆叠在其中的多个基板的主体; 多个电阻器，其形成在主体中，各自的基板插入其间并通过主体的两个端面露出; 以及分别覆盖主体的两个端面的第一和第二电极，并且分别连接到暴露的电阻器的两个端部。

公开(公告)号：US20180254149A1

公开(公告)日：2018-09-06

申请号：US15970281

申请日：2018-05-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hun CHO ,  Chang Ho LEE ,  Won Sik CHONG

IPC: H01G4/38 ,  H01G4/30 ,  H01G4/232

CPC classification number: H01G4/385 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/2325 ,  H01G4/30

Abstract: An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.

公开(公告)号：US20160104577A1

公开(公告)日：2016-04-14

申请号：US14876774

申请日：2015-10-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hun CHO ,  Chang Ho LEE ,  Won Sik CHONG

IPC: H01G4/248 ,  H01G4/38 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/385 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/2325 ,  H01G4/30

Abstract: An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.

Abstract translation: 多层结构的电子部件包括通过堆叠多个陶瓷体和由用于连接每个陶瓷体的导电树脂制成的外部电极而形成的层压体。

公开(公告)号：US20170358396A1

公开(公告)日：2017-12-14

申请号：US15687913

申请日：2017-08-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Hun CHO ,  Chang Ho LEE ,  Won Sik CHONG

IPC: H01G4/38 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01G4/12

CPC classification number: H01G4/385 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/2325 ,  H01G4/30

Abstract: An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.