公开(公告)号：US20170005032A1

公开(公告)日：2017-01-05

申请号：US14991589

申请日：2016-01-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Su KIM ,  Tae Gu KIM ,  Sung Ho KIM

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L24/33 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/81

Abstract: A lead frame and a stack package module including the same are provided. The lead frame including a lower-end coupling portion coupled to a lower package through soldering, and an upper-end connecting portion contacting a side surface groove formed in a side surface of an upper package to support the upper package.

Abstract translation: 提供了包括它的引线框架和堆叠封装模块。 引线框架包括通过焊接耦合到下封装的下端耦合部分，以及接触形成在上封装的侧表面中的侧表面槽的上端连接部分，以支撑上封装。