公开(公告)号：US20140177283A1

公开(公告)日：2014-06-26

申请号：US13946890

申请日：2013-07-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Kook KIM ,  Chong Eun KIM ,  Sung Ho KIM ,  Dong Kyun RYU

IPC: H02M3/335

CPC classification number: H02M3/33576 ,  H02M2001/0058 ,  H02M2001/007 ,  H02M2001/0096 ,  Y02B70/1491

Abstract: There is provided a power supply including a direct current (DC) to DC converter supplying main power to a load, and a sub converter connected to the DC to DC converter and reducing output loss, wherein the sub converter is operable based on a hold-up time.

Abstract translation: 提供了一种电源，其包括向负载提供主电力的直流（DC）到DC转换器以及连接到DC-DC转换器的子转换器，并且减小输出损耗，其中所述副转换器可基于保持 - 上班时间

公开(公告)号：US20170018540A1

公开(公告)日：2017-01-19

申请号：US15075824

申请日：2016-03-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun LIM ,  Jong In RYU ,  Sung Ho KIM ,  Jin Su KIM

IPC: H01L25/16 ,  H01L23/31 ,  H01L25/00 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L25/16 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01R23/68 ,  H01R23/6886 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/049 ,  H01L2924/014 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099

Abstract: In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

Abstract translation: 在一个一般方面，电子设备模块包括第一板，安装在第一板的第一表面上的第一装置，设置在第一板下方的第二板，以及设置在第一板和第二板之间的多个第二装置 其中，所述多个第二装置的表面结合到所述第一板的第二表面，并且所述第二装置中的每一个的另一表面结合到所述第二板。

公开(公告)号：US20140185329A1

公开(公告)日：2014-07-03

申请号：US13839355

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Kuk KIM ,  Chong Eun KIM ,  Sung Ho KIM ,  Dong Kyun RYU

IPC: H02M3/28

CPC classification number: H02M3/33538 ,  H02M2003/1586

Abstract: There is provided a power supply apparatus including an interleaved active clamp forward converter unit including a first active clamp forward converter and a second active clamp forward converter, and an output unit magnetically coupled to the forward converter unit and having an output path according to a duty ratio of the forward converter unit, wherein the output unit includes a third powering leg electrified when the first active clamp forward converter and the second active clamp forward converter are powered, and an output leg supplying power to a load.

Abstract translation: 提供了一种电源装置，其包括交错的有源钳位正激转换器单元，其包括第一有源钳位正激转换器和第二有源钳位正激转换器，以及输出单元，其磁耦合到正激转换器单元并具有根据占空比的输出路径 正向转换器单元的比率，其中当第一有源钳位正激转换器和第二有源钳位正激转换器被供电时，输出单元包括通电的第三供电支路，以及向负载供电的输出支路。

公开(公告)号：US20170005032A1

公开(公告)日：2017-01-05

申请号：US14991589

申请日：2016-01-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Su KIM ,  Tae Gu KIM ,  Sung Ho KIM

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L24/33 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/81

Abstract: A lead frame and a stack package module including the same are provided. The lead frame including a lower-end coupling portion coupled to a lower package through soldering, and an upper-end connecting portion contacting a side surface groove formed in a side surface of an upper package to support the upper package.

Abstract translation: 提供了包括它的引线框架和堆叠封装模块。 引线框架包括通过焊接耦合到下封装的下端耦合部分，以及接触形成在上封装的侧表面中的侧表面槽的上端连接部分，以支撑上封装。

公开(公告)号：US20130155350A1

公开(公告)日：2013-06-20

申请号：US13762056

申请日：2013-02-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Gyoon CHOI ,  Jin Woo CHO ,  Sung Ho KIM

IPC: G02F1/1335

CPC classification number: G02F1/133602 ,  G02F1/13452 ,  G02F2001/133334

Abstract: There are provided a power module and a display device. There is provided the power module for a display device that includes a panel, a backlight unit supporting the panel and including a light source, and a conductive back cover coupled to the backlight unit, the power module including: a circuit board supplying power to the light source included in the backlight unit; a transformer mounted on the circuit board and supplying power to the circuit board; and a shielding plate mounted on the circuit board and covering, in a non-contact manner, the upper surface of the transformer opposed to the lower surface 401 of the transformer facing the surface of the circuit board. There is provided a display device including such a power module.

Abstract translation: 提供了电源模块和显示装置。 提供了一种用于显示装置的电源模块，包括面板，支撑面板并包括光源的背光单元和耦合到背光单元的导电后盖，电源模块包括：电路板，用于向 光源包括在背光单元中; 安装在电路板上的变压器并向电路板供电; 以及屏蔽板，其安装在电路板上，并以非接触的方式覆盖变压器的与面向电路板表面的下表面401相对的上表面。 提供了包括这种电源模块的显示装置。

公开(公告)号：US20150227170A1

公开(公告)日：2015-08-13

申请号：US14602875

申请日：2015-01-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Ho KIM ,  Jae Hun KIM ,  Jin Uk LEE

IPC: G06F1/16 ,  G06F3/041 ,  B32B37/24 ,  G06F3/044

CPC classification number: G06F1/1643 ,  B32B2457/208 ,  G06F3/044 ,  G06F2203/04103 ,  Y10T156/10

Abstract: Embodiments of the invention provide a touch sensor, including a first window substrate, a dam formed along an edge of the first window substrate, and a polymer layer formed on the first window substrate in an inside direction of the dam. According to at least one embodiment, the touch sensor further includes a bezel formed to be disposed outside the dam and formed on the first window substrate, and a second window substrate having one surface formed to face the first window substrate and the other surface provided with an electrode pattern, and provided with an electrode wiring, which is electrically connected to the electrode pattern.

Abstract translation: 本发明的实施例提供了一种触摸传感器，包括第一窗口基板，沿着第一窗口基板的边缘形成的坝，以及在坝的内部方向上形成在第一窗户基板上的聚合物层。 根据至少一个实施例，触摸传感器还包括形成为设置在坝外部并形成在第一窗口基板上的边框，以及第二窗口基板，其具有形成为面对第一窗口基板的一个表面，而另一个表面设置有 电极图案，并且设置有电连接到电极图案的电极配线。