摘要:
There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween, wherein when a width of an upper surface of the ceramic body is defined as Wa, 0.800≦Wa/W≦0.985 is satisfied.
摘要翻译:提供了一种多层陶瓷电子部件及其安装基板,所述多层陶瓷电子部件包括具有六面体形状的陶瓷体,包括电介质层,并且当所述陶瓷体的长度被定义为L时,满足T / W> 1.0 将陶瓷体的下表面的宽度定义为W,将陶瓷体的厚度定义为T,将第一和第二内部电极堆叠在陶瓷体中,使其彼此面对,具有各自的电介质 插入其间的层,其中当陶瓷体的上表面的宽度被定义为Wa时,满足0.800≦̸ Wa / W≦̸ 0.985。
摘要:
A multilayer ceramic electronic component includes: a ceramic body including a recess portion formed in a length direction of at least one main surface thereof so as to be inwardly concave and satisfying T (thickness)/W (width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to the at least one main surface, wherein when the ceramic body is divided into an upper region At, corresponding to 70% to 90% of an overall thickness of the ceramic body, and a lower region Ab, corresponding to 10% to 30% of the overall thickness of the ceramic body, a ratio of an average particle size of Ab materials to an average particle size of At materials is less than 0.5.
摘要:
There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.
摘要:
There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component, including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W1.0 when a length of the ceramic body is defined as L, a width of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers interposed therebetween.
摘要:
There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and satisfying T/W>1.1 when a width thereof is defined as W and a thickness thereof is defined as T; first internal electrodes each having a first lead part exposed to at least one side surface of the ceramic body; second internal electrodes each having a second lead part exposed to the at least one side surface of the ceramic body; first and second external electrodes electrically connected to the first lead part and the second lead part, respectively, and extended from the side surface of the ceramic body to which the first lead part and the second lead part are exposed to at least one of the first and second main surfaces; and an insulating layer formed to cover the first and second external electrodes formed on the first and second side surfaces.
摘要:
There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers, and having first and second main surfaces, first and second side surfaces and first and second end surfaces; first and second internal electrodes having overlap regions forming a capacitance part, the first internal electrodes having a first lead out portion to be exposed to the first side surface, and being alternately laminated with the second internal electrodes while being insulated therefrom, the second internal electrodes having a second lead out portion; first and second external electrodes connected to the first and second lead out portions, respectively; and an insulating layer formed on the first side surface, wherein a length of the first lead out portion is longer than that of the second lead out portion and the capacitance part has different distances from the first side surface.
摘要:
There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers having an average thickness of 0.6 μm or less; and first and second internal electrodes, wherein the ceramic body includes a capacitance formation part and a non-capacitance formation part provided on at least one surface of upper and lower surfaces of the capacitance formation part, and when the capacitance formation part is divided into three regions in a thickness direction of the ceramic body, in a central region among the three regions, dielectric grains have an average particle size of 150 nm or less, and the number of dielectric grains per layer is 4 or more, and in upper and lower regions, dielectric grains have an average particle size of 200 nm or less, respectively, and the number of dielectric grains per layer is 3 or more.
摘要:
There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component, including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W1.0 when a length of the ceramic body is defined as L, a width of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers interposed therebetween.
摘要:
There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; an active layer in which capacitance is formed, by including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and having a greater thickness than the upper cover layer; and first and second external electrodes covering the end surfaces of the ceramic body, wherein when a thickness of the lower cover layer is defined as Tb, 0.03≦Tb/T≦0.25 is satisfied.
摘要:
There is provided a multilayer ceramic electronic component, including: a ceramic body having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first block including first and second internal electrodes having overlap regions which form a capacitance part; one or more second blocks each including third and fourth internal electrodes having overlap regions which form a capacitance part; a first external electrode connected to the first and third lead out portions and a second external electrode connected to the second and fourth lead out portions; and an insulating layer formed on the first side surface of the ceramic body, wherein the second blocks are disposed on upper and lower parts of the first block.