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公开(公告)号:US11490503B2
公开(公告)日:2022-11-01
申请号:US17204058
申请日:2021-03-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chang Hwa Park , Chi Seong Kim , Eun Heay Lee , Yo Han Song , Gun Hwi Hyung , Jae Heun Lee , Deok Man Kang , Jin Oh Park
Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
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公开(公告)号:US20220022310A1
公开(公告)日:2022-01-20
申请号:US17204058
申请日:2021-03-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chang Hwa Park , Chi Seong Kim , Eun Heay Lee , Yo Han Song , Gun Hwi Hyung , Jae Heun LEE , Deok Man Kang , Jin Oh Park
Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
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