公开(公告)号：US11490503B2

公开(公告)日：2022-11-01

申请号：US17204058

申请日：2021-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun Lee ,  Deok Man Kang ,  Jin Oh Park

IPC: H05K3/22 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30

Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

公开(公告)号：US20220022310A1

公开(公告)日：2022-01-20

申请号：US17204058

申请日：2021-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun LEE ,  Deok Man Kang ,  Jin Oh Park

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/00

Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.